ASSEMBLED CIRCUIT AND ELECTRONIC COMPONENT

• US 20090175014A1
• Filed: 01/02/2009
• Published: 07/09/2009
• Est. Priority Date: 01/03/2008
• Status: Active Grant

• Current Assignee: Delta Electronics Incorporated
• Original Assignee: Delta Electronics Incorporated
• Inventors: Hong, Shou-Yu, Zeng, JIAN-HONG, Yang, Wei, Ying, Jian-Ping
• Granted Patent: US 8,283,789 B2
• Time in Patent Office: Days
• US Class Current: 361/782
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 2017/048 with encapsulating core, e.g. made of resin and magnetic powder
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 27/29 Terminals; Tapping arrangements for signal inductances
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H02M 3/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/145 Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
• CPC Class Codes: H05K 2201/1003 Non-printed inductor
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 2201/1053 Mounted components directly electrically connected to each other, i.e. not via the PCB
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers
• CPC Class Codes: H05K 7/026 Multiple connections subassemblies
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

An assembled circuit comprising an inductive component, a connecting conductor, and a first electronic component is disclosed. The connecting conductor is adapted to wrap a first surface of the inductive component. The first electronic component stacks on the inductive component. The assembled circuit is electrically connected to the carrier via the connecting conductor.

Claims

1. An assembled circuit, comprising:

an inductive component;

a connecting conductor, adapted to wrap a first surface of the inductive component; and

a first electronic component, stacking with the inductive component and electrically connecting to the inductive component,

wherein the inductive component and the first electronic component electrically connect to a first carrier via the connecting conductor.

2. The assembled circuit as claimed in claim 1, wherein the inductive component is an inductor.

3. The assembled circuit as claimed in claim 1, wherein the connecting conductor is a flat conductor.

4. The assembled circuit as claimed in claim 1, wherein the first electronic component is one of an inductor, a resistor, a capacitor, an FET, a control chip, and an integrated circuit.

5. The assembled circuit as claimed in claim 2, wherein the inductor comprises a pin conductor, adapted to wrap a second surface of the inductor, wherein the pin conductor is configured to be pins of the inductor for indirect connection with the connecting conductor via the first carrier.

6. The assembled circuit as claimed in claim 2, wherein the inductor comprises an insulating layer.

7. The assembled circuit as claimed in claim 6, wherein the insulating layer is a layer of magnetic material.

8. The assembled circuit as claimed in claim 7, wherein the inductive component is a co-fired magnetic material inductor.

9. The assembled circuit as claimed in claim 7, wherein the inductive component is a wire wound compressed inductor.

10. The assembled circuit as claimed in claim 1, further comprising a second carrier, wherein the first electronic component and the inductive component are disposed at two sides of the second carrier respectively.

11. The assembled circuit as claimed in claim 10, wherein the second carrier is a circuit board.

12. The assembled circuit as claimed in claim 1, wherein the first electronic component is connected to the connecting conductor directly.

13. The assembled circuit as claimed in claim 1, wherein the connecting conductor wraps the inductive component by one of a deposition process, a compression process, a lamination process and an adhesion process.

14. The assembled circuit as claimed in claim 1, wherein the assembled circuit is adapted for a DC to DC converter.

15. An electronic component, adapted for an assembled circuit comprising a first carrier, comprising:

an electronic component body; and

a connecting conductor, adapted to wrap a first surface of the electronic component body,

wherein the electronic component body connects to the first carrier via the connecting conductor.

16. The electronic component as claimed in claim 15, wherein the connecting conductor is a flat conductor.

17. The electronic component as claimed in claim 15, wherein the first carrier is a circuit board.

18. The electronic component as claimed in claim 15, further comprising a pin conductor, adapted to wrap a second surface of the electronic component body, wherein the pin conductor is configured to be pins of the electronic component body, and at least a portion of the connecting conductor on the first surface and the pin conductor on the second surface connect indirectly via the first carrier.

19. The electronic component as claimed in claim 15, wherein the electronic component body is an inductive component.

20. The electronic component as claimed in claim 19, wherein the inductive component comprises an insulating layer.

21. The electronic component as claimed in claim 20, wherein the insulating layer is a layer of magnetic material.

22. The electronic component as claimed in claim 19, wherein the inductive component is a co-fired magnetic material inductor.

23. The electronic component as claimed in claim 19, wherein the inductive component is a wire wound inductor.

24. The electronic component as claimed in claim 15, wherein the electronic component body is one of an inductor, a resistor, a capacitor, a field effect transistor, a control chip, and an integrated circuit.

25. The electronic component as claimed in claim 15, wherein the connecting conductor wraps the electronic component body by one of a deposition process, a compression process, a lamination process, and an adhesion process.