Vibration transducer

• US 20090175477A1
• Filed: 08/14/2008
• Published: 07/09/2009
• Est. Priority Date: 08/20/2007
• Status: Abandoned Application

• Current Assignee: Yamaha Corporation
• Original Assignee: Yamaha Corporation
• Inventors: Nagata, Tatsuya, Muroi, Kunimasa, Suzuki, Yukitoshi, Suzuki, Toshihisa
• Application Number:
  US12/228,589
• Publication Number:
  US 20090175477A1
• Time in Patent Office: Days
• US Class Current: 381/355
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence

Abstract

A vibration transducer (e.g. a condenser microphone) having a high sensitivity is constituted of a housing composed of an airtight material having a through-hole, a vibration conversion die (e.g. a microphone die) which is attached to the interior surface of the housing at the prescribed position embracing the through-hole in plan view, and a barrier diaphragm composed of an airtight material whose external periphery is attached to the exterior surface of the housing in an airtight manner oppositely to the prescribed position. The barrier diaphragm has a vibration area which is larger than the sectional area of the through-hole. A space allowing the barrier diaphragm to vibrate is formed between the barrier diaphragm and the exterior surface of the housing, wherein the distance between the barrier diaphragm and the exterior surface of the housing can be gradually reduced from the vibration axis to the external periphery.

Claims

1. A vibration transducer comprising:

a housing composed of an airtight material and having a through-hole;

a vibration conversion die which is attached to an interior surface of the housing in an airtight manner at a first position embracing the through-hole in plan view; and

a barrier diaphragm whose external periphery is attached to an exterior surface of the housing at a second position vertically matching the first position for embracing the through-hole in plan view, wherein the barrier diaphragm composed of an airtight material has a vibration area which is larger than a sectional area of the through-hole,

wherein a space allowing the barrier diaphragm to vibrate is formed between the barrier diaphragm and the exterior surface of the housing.

2. A vibration transducer according to claim 1, wherein a distance between the barrier diaphragm and the exterior surface of the housing gradually decreases in a direction from a vibration axis of the barrier diaphragm to the external periphery of the barrier diaphragm.

3. A vibration transducer according to claim 1, wherein at least one projection which projects from the exterior surface of the housing towards the barrier diaphragm is formed at a prescribed area of the exterior surface of the housing positioned opposite to the barrier diaphragm.

4. A vibration transducer according to claim 1, wherein the housing and the vibration conversion die are subjected to a flip-chip connection established therebetween via a plurality of bumps forming a gap therebetween, which is sealed with a resin.

5. A vibration transducer according to claim 1, wherein the barrier diaphragm has an electromagnetic shield function.

6. A vibration transducer according to claim 1, wherein the barrier diaphragm has an optical shield function.

7. A vibration transducer according to claim 1, wherein the barrier diaphragm has water repellency.

8. A vibration transducer according to claim 1, wherein the barrier diaphragm has a laminated structure constituted of a resin film and a metal film.

9. A vibration transducer according to claim 1, wherein the barrier diaphragm has a vibration area which is larger than a bottom area of the vibration transducer die.

10. A vibration transducer according to claim 1, wherein the barrier diaphragm has a vibration area which is substantially identical to an internal bottom area of the housing.