Detachment mechanisms for implantable devices

• US 20090177261A1
• Filed: 01/05/2009
• Published: 07/09/2009
• Est. Priority Date: 01/04/2008
• Status: Abandoned Application

• Current Assignee: Boston Scientific Scimed (Boston Scientific Corporation)
• Original Assignee: Boston Scientific Scimed (Boston Scientific Corporation)
• Inventors: Carroll, Kirsten, Sutermeister, Derek, Mirigian, Gregory E., Arcand, Benjamin, Williams, Michael, Teoh, Clifford, Rassat, Jay, Anderson, James M.
• Application Number:
  US12/319,255
• Publication Number:
  US 20090177261A1
• Time in Patent Office: Days
• US Class Current: 623/1.110
• CPC Class Codes: A61B 17/12022 Occluding by internal devices, e.g. balloons or releasable wires plugging an opening in the wall of an organ A61B17/0057; occluders for the cervical canal A61F6/146; vas deferens occluders A61F6/20
• CPC Class Codes: A61B 17/12109 in a blood vessel
• CPC Class Codes: A61B 17/12113 within an aneurysm
• CPC Class Codes: A61B 17/1214 Coils or wires
• CPC Class Codes: A61B 17/12145 having a pre-set deployed three-dimensional shape methods of manufacturing A61B2017/00526
• CPC Class Codes: A61B 2017/12068 detachable by heat
• CPC Class Codes: A61B 2017/12077 Joint changing shape upon application of heat, e.g. bi-metal or reversible thermal memory
• CPC Class Codes: A61B 2017/1209 detachable by electrical current or potential, e.g. electroactive polymer

Abstract

Disclosed herein are detachment mechanisms for vaso-occlusive devices that allow for rapid operator-controlled release of the vaso-occlusive device into the selected site. Also disclosed are vaso-occlusive assemblies comprising these detachment mechanisms and methods of using these detachment mechanisms and vaso-occlusive assemblies.

Claims

1. A detachment mechanism for an implantable device, the detachment mechanism comprising:

at least one material that changes configuration upon application of heat or electrical energy, wherein the change in configuration releases the implantable device, and further wherein if the material extends into a lumen of the implantable device, the material directly contacts at least a portion the implantable device.

2. The detachment mechanism of claim 1, wherein the change in configuration comprises a reduction in diameter and/or volume of the material.

3. The detachment mechanism of claim 1, wherein the change in configuration comprises an expansion in diameter and/or volume of the material.

4. The detachment mechanism of claim 1, wherein the change in configuration comprises a deflection of the detachment mechanism.

5. The detachment mechanism of claim 1, wherein the detachment mechanism comprises an electroactive polymer.

6. The detachment mechanism of claim 5, wherein the detachment mechanism further comprises a metal or polymer and wherein the electroactive polymer is layered onto the metal or polymer.

7. The detachment mechanism of claim 1, wherein the detachment mechanism comprises a layered strip of two or more metals of dissimilar thermal coefficients.

8. The detachment mechanism of claim 7, wherein the layered strip is wound into a spiral shape.

9. The detachment mechanism of claim 1, wherein the at least one material that changes configuration directly contacts a source of electric or heat energy.

10. The detachment mechanism of claim 1, wherein the detachment mechanism directly engages the vaso-occlusive device.

11. The detachment mechanism of claim 1, wherein the detachment mechanism contacts a structure attached to the implantable device.

13. A vaso-occlusive assembly comprising

a vaso-occlusive device;

a detachment mechanism according to claim 1; and

a source of electrical current or a heat source in contact with the detachment mechanism.

14. The vaso-occlusive assembly of claim 13, wherein the vaso-occlusive device comprises a helically wound vaso-occlusive coil.

15. The vaso-occlusive assembly of claim 13, further comprising a delivery mechanism.

16. The vaso-occlusive assembly of claim 15, wherein the delivery mechanism comprises a stopper element.

18. A method of at least partially occluding an aneurysm, the method comprising the steps of

introducing a vaso-occlusive assembly according to claim 13, into the aneurysm, wherein the detachment mechanism engages the vaso-occlusive device;

and

changing the configuration of the detachment mechanism by applying or removing electrical current or thermal energy such that the detaching mechanism releases the vaso-occlusive device into the aneurysm.

12. A detachment mechanism adapted to detachably engage a vaso-occlusive device, the detachment mechanism comprising

an element that changes configuration upon application of electrical current or heat;

and

means for applying electrical current or heat to the change the configuration of the element.

17. A vaso-occlusive assembly comprising

a vaso-occlusive device;

a detachment mechanism according to claim 12; and

a source of electrical current or a heat source in contact with the detachment mechanism.