PROCESS AND SYSTEM FOR QUALITY MANAGEMENT AND ANALYSIS OF VIA DRILLING

• US 20090179017A1
• Filed: 03/27/2009
• Published: 07/16/2009
• Est. Priority Date: 07/11/2006
• Status: Active Grant

• Current Assignee: Electro Scientific Industries Incorporated (MKS Instruments Incorporated)
• Original Assignee: Electro Scientific Industries Incorporated (MKS Instruments Incorporated)
• Inventors: Baldwin, Leo, Matsumoto, Hisashi, Singer, Mark, Howerton, Jeffrey E., Childers, David V.
• Granted Patent: US 8,501,021 B2
• Time in Patent Office: Days
• US Class Current: 219/121.710
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: B23K 26/03 Observing, e.g. monitoring, the workpiece
• CPC Class Codes: B23K 26/06 Shaping the laser beam, e.g. by masks or multi-focusing
• CPC Class Codes: B23K 26/389 of fluid openings, e.g. nozzles, jets laser machining of inkjet nozzles B41J2/1634
• CPC Class Codes: H05K 1/0269 for visual or optical inspection
• CPC Class Codes: H05K 2201/09454 Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
• CPC Class Codes: H05K 2203/163 Monitoring a manufacturing process
• CPC Class Codes: H05K 3/0035 of blind holes, i.e. having a metal layer at the bottom

Abstract

A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry can include, for at least one blind via to be formed in at least one layer of a circuit substrate, evaluating a capture pad geometry value (such as area and/or volume) within a predetermined distance from a drilling location with respect to a blind via geometry value (such as area and/or volume) to be formed at the drilling location. The process can include setting at least one laser operating parameter based on the evaluation in order to obtain a desired capture pad appearance after blind via formation. The process can include imaging a capture pad area defined as an area within a predetermined distance from a blind via drilling location in at least one layer of a circuit substrate, quantifying at least one appearance value for the imaged capture pad area, and determining an acceptability of the imaged capture pad areas based on the quantified appearance value.

Claims

1. A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry, comprising:

before blind via drilling and for at least one blind via to be drilled in at least one layer of a circuit substrate, evaluating a capture pad geometry value within a predetermined distance from a drilling location with respect to a blind via geometry value to be drilled at the drilling location; and

setting at least one laser operating parameter based on a result of the evaluation in order to obtain a desired capture pad appearance after blind via drilling.

2. The process of claim 1 wherein the at least one laser process parameter to be set comprises at least one of laser fluence, number of laser pulses and laser pulse width.

3. The process of claim 1, further comprising:

comparing an anticipated blind via location on a given drill layer to an anticipated blind via location on an adjacent drill layer to determine if blind vias are stacked from layer to layer.

5. The process of claim 1, further comprising:

analyzing a capture pad appearance after blind via drilling.

6. The process of claim 5 wherein analyzing a capture pad appearance after blind via drilling comprises:

imaging a capture pad area defined as an area within a predetermined distance from a blind via drilling location in at least one layer of a circuit substrate;

quantifying an appearance value for the imaged capture pad area as a numerical appearance value indicative of a subjective quality judgment of the imaged capture pad area; and

determining acceptability of the imaged capture pad area based on the quantified appearance value.

8. The process of claim 6 wherein quantifying the appearance value comprises:

performing a fractal dimension analysis on the imaged capture pad area to obtain the numerical appearance value as a fractal dimension, wherein a level of the numerical appearance value corresponds to a subjective surface texture for the imaged capture pad area.

9. The process of claim 6 wherein quantifying the appearance value comprises:

performing a histogram analysis on the imaged capture pad area to obtain the numerical appearance value as a symmetry between populations in the histogram, wherein the symmetry corresponds to a subjective surface texture for the imaged capture pad area.

13. The process of claim 5 wherein setting at least one laser parameter comprises:

adjusting at least one laser process parameter based on feedback from a relationship between a ratio of capture pad geometry value to blind via geometry value and an analyzed capture pad appearance for a plurality of capture pad areas with drilled blind vias located in the plurality of capture pad areas.

14. The process of claim 1 wherein evaluating the capture pad geometry value comprises:

calculating a ratio of the capture pad geometry value within the predetermined distance from the drilling location with respect to the blind via geometry value to be drilled at the drilling location for each blind via to be drilled in the at least one layer of the circuit substrate.

31. The process of claim 1, further comprising:

using a laser to form a blind via in at least one layer of the circuit substrate.

32. The process of claim 1, further comprising:

comparing an actual blind via location on a given drill layer to an actual blind via location on an adjacent drill layer to determine if blind vias are stacked from layer to layer.

33. The process of claim 13 wherein the at least one laser process parameter to be set comprises at least one of laser fluence, number of laser pulses and laser pulse width.

4. (canceled)

7. (canceled)

10-12. -12. (canceled)

15-30. -30. (canceled)