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Flip-chip phosphor coating method and devices fabricated utilizing method

  • US 20090179207A1
  • Filed: 01/11/2008
  • Published: 07/16/2009
  • Est. Priority Date: 01/11/2008
  • Status: Active Grant
First Claim
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1. A method for fabricating light emitting diode (LED) chips, comprising:

  • flip-chip mounting a plurality of LEDs on a surface of a submount wafer;

    forming a coating over said LEDs, said coating comprising a conversion material at least partially covering said LEDs;

    planarizing said coating to the desired thickness, said coating being substantially continuous and unobstructed on the top surface of said LEDs; and

    singulating said LED chips from said submount wafer.

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