HIGH TEMPERATURE VACUUM CHUCK ASSEMBLY

• US 20090179365A1
• Filed: 01/15/2008
• Published: 07/16/2009
• Est. Priority Date: 01/15/2008
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Lerner, Alexander N., Behdjat, Mehran, Koelmel, Blake
• Granted Patent: US 8,198,567 B2
• Time in Patent Office: Days
• US Class Current: 269/21
• CPC Class Codes: B25B 11/005 Vacuum work holders
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 21/6875 characterised by a plurality of individual support members, e.g. support posts or protrusions
• CPC Class Codes: H01L 21/68785 characterised by the mechanical construction of the susceptor, stage or support
• CPC Class Codes: H01L 21/68792 characterised by the construction of the shaft
• CPC Class Codes: Y10T 279/11 Vacuum

Abstract

A vacuum chuck and a process chamber equipped with the same are provided. The vacuum chuck assembly comprises a support body, a plurality of protrusions, a plurality of channels, at least one support member supporting the support body, at least one resilient member coupled with the support member, a hollow shaft supporting the support body, at least one electrical connector disposed through the hollow shaft, and an air-cooling apparatus. The support body has a support surface for holding a substrate (such as a wafer) thereon. The protrusions are formed on and project from the support surface for creating a gap between the substrate and the support surface. The channels are formed on the support surface for generating reduced pressure in the gap. The air-cooling apparatus is used for providing air cooling in the vicinity of the electrical connector.

Claims

1. A vacuum chuck assembly, comprising:

a support body having a support surface for holding a substrate thereon;

at least one support member supporting the support body; and

at least one resilient member coupled with the at least one support member.

2. The vacuum chuck assembly of claim 1, wherein the at least one resilient member provides control force to pull the support body downwards when the support body bows upwards as a result of heating.

3. The vacuum chuck assembly of claim 1, further comprising:

a hollow shaft supporting the support body, wherein the at least one support member is disposed inside the hollow shaft.

4. The vacuum chuck assembly of claim 1, wherein the at least one resilient member is at least one spring.

5. The vacuum chuck assembly of claim 1, further comprising:

a hollow shaft supporting the support body; and

at least one electrical connector disposed through the hollow shaft, wherein the at least one electrical connector has one or more cooling channels.

6. A vacuum chuck assembly, comprising:

a support body having a support surface for holding a substrate thereon;

a plurality of protrusions formed on the support surface, the protrusions projecting from the support surface for creating a gap between the substrate and the support surface; and

a plurality of channels formed on the support surface for generating reduced pressure in the gap.

7. The vacuum chuck assembly of claim 6, wherein the protrusions are 25 micron protrusions.

8. The vacuum chuck assembly of claim 6, wherein the protrusions are unitary with the support surface.

9. The vacuum chuck assembly of claim 7, wherein each of the protrusions has a planarized top surface for contacting the substrate.

10. The vacuum chuck assembly of claim 7, wherein the planarized top surface is rounded.

11. The vacuum chuck assembly of claim 7, further comprising:

at least one support member supporting the support body; and

at least one resilient member coupled with the at least one support member.

12. The vacuum chuck assembly of claim 7, wherein the at least one resilient member provides control force to pull the support body downwards when the support body bows upwards as a result of heating.

13. A process chamber, comprising:

a chamber mount;

a support body having a support surface for holding a substrate thereon;

a plurality of protrusions formed on the support surface, the protrusions projecting from the support surface for creating a gap between the substrate and the support surface, wherein each of the protrusions has a planarized top surface for contacting the substrate;

a plurality of channels formed on the support surface for generating reduced pressure in the gap;

at least one support member supporting the support body; and

at least one resilient member coupled between the chamber mount and the at least one support member.

14. The process chamber of claim 13, wherein the protrusions are 25 micron protrusions.

15. The process chamber of claim 13, wherein the protrusions are unitary with the support surface.

16. The process chamber of claim 13, wherein the planarized top surface is rounded.

17. The process chamber of claim 13, wherein each of the protrusions is formed in a hemispherical-like shape.

18. The process chamber of claim 13, wherein the at least one resilient member provides control force to pull the support body downwards when the support body bows upwards as a result of heating.

19. The process chamber of claim 13, further comprising:

a hollow shaft supporting the support body, wherein the at least one support member is disposed inside the hollow shaft.

20. The process chamber of claim 13, further comprising:

a hollow shaft supporting the support body; and

at least one electrical connector assembly disposed through the hollow shaft, wherein the at least one electrical connector assembly has cooling channels disposed therein.