ACTUATOR

• US 20090180168A1
• Filed: 09/19/2006
• Published: 07/16/2009
• Est. Priority Date: 09/21/2005
• Status: Active Grant

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Obi, Hiroshi, Kurozuka, Akira
• Granted Patent: US 7,872,395 B2
• Time in Patent Office: Days
• US Class Current: 359/221.200
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means

Abstract

An actuator 1 according to the present invention includes: a first movable section 5; a second movable section 6 supporting the first movable section 5; and a stationary section 13 supporting the second movable section 6. The second movable section 6 includes: a first conductive portion 6a for applying a first voltage to the first movable section 5; a second conductive portion 6b to which a second voltage is applied; and backlining 15 for stabilizing the first conductive portion 6a and the second conductive portion 6b to each other in an electrically insulated state. The backlining 15 stabilizes the first conductive portion 6a and the second conductive portion 6b from a face of the actuator 1 opposite from the face on which the mirror section 34 is provided.

Claims

1. An actuator comprising:

a first movable section;

a second movable section supporting the first movable section; and

a stationary section supporting the second movable section, wherein,

the second movable section includes;

a first conductive portion for applying a first voltage to the first movable section;

a second conductive portion to which a second voltage is applied; and

backlining for stabilizing the first conductive portion and the second conductive portion to each other in an electrically insulated state.

2. The actuator of claim 1, wherein,

the first movable section includes a mirror section for reflecting light;

and

the backlining stabilizes the first conductive portion and the second conductive portion from a face of the actuator opposite from a face on which the mirror section is provided.

3. The actuator of claim 1, wherein the first conductive portion and the second conductive portion are electrically insulated from each other by a trench which is formed between the first conductive portion and the second conductive portion of the second movable section.

4. The actuator of claim 3, wherein a dummy trench is formed in a point symmetric position from the trench in the second movable section.

5. The actuator of claim 1, wherein,

the first and second movable sections are formed by, in an SOI wafer in which first and second silicon layers are bonded via an insulating layer, etching the first silicon layer;

and

the backlining is formed by etching the second silicon layer.

6. The actuator of claim 1, wherein,

the first movable section includes first and second electrode combteeth for generating a driving force for causing a relative displacement of the first movable section with respect to the second movable section,

the first electrode combteeth extend in a direction which is perpendicular to a pivot axis of the first movable section;

the second electrode combteeth extend in a direction which is parallel to the pivot axis of the first movable section;

the second movable section includes third and fourth electrode combteeth for generating a driving force for causing a relative displacement of the second movable section with respect to the stationary section;

the third electrode combteeth extend in a direction which is perpendicular to a pivot axis of the second movable section; and

the fourth electrode combteeth extend in a direction which is parallel to the pivot axis of the second movable section.

7. A production method for the actuator of claim 1,

the production method comprising:

a step of forming the first and second movable sections by, in an SOI wafer in which first and second silicon layers are bonded via an insulating layer, etching the first silicon layer; and

a step of forming the backlining by etching the second silicon layer.

8. The production method of claim 7, wherein the step of forming the backlining includes:

a step of forming a resist pattern that masks a position on the second silicon layer at which to form the backlining;

a step of etching the second silicon layer to a depth corresponding to a thickness of the second silicon layer to be left as the backlining;

a step of removing the resist pattern, and etching the second silicon layer until the insulating layer is exposed in a position other than the position at which to form the backlining; and

a step of removing a exposed portion of the insulating layer.