PACKAGE FOR MEMS MICROPHONE

• US 20090180655A1
• Filed: 10/31/2008
• Published: 07/16/2009
• Est. Priority Date: 01/10/2008
• Status: Abandoned Application

• Current Assignee: Lingsen Precision Industries, Ltd.
• Original Assignee: Lingsen Precision Industries, Ltd.
• Inventors: TIEN, Jiung-Yue, Yang, Hsin-Tao
• Application Number:
  US12/262,939
• Publication Number:
  US 20090180655A1
• Time in Patent Office: Days
• US Class Current: 381/361
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H04R 1/086 Protective screens, e.g. all weather or wind screens
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182

Abstract

A package for a MEMS microphone includes a cover, a substrate connected with the cover to define with the cover an accommodation chamber and having a channel in communication between the accommodation chamber and the space outside the cover, and a single chip disposed in the accommodation chamber and electrically connected with the substrate and corresponding to the channel of the substrate. Thus, an acoustic single can enter the accommodation chamber to reach the single chip through the channel for minimizing the dimensions of the package of the present invention.

Claims

1. A package for a MEMS microphone comprising:

a cover;

a substrate connected with said cover to define with said cover an accommodation chamber and having a channel in communication between said accommodation chamber and the space outside said cover; and

a single chip disposed in said accommodation chamber and electrically connected with said substrate and corresponding to said channel of said substrate.

2. The package as claimed in claim 1, wherein said cover has an acoustic hole in communication between said channel of said substrate and the space outside said cover.

3. The package as claimed in claim 1, wherein said substrate has an acoustic hole in communication between said channel of said substrate and the space outside said cover.