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THIN-FILM ASSEMBLY AND METHOD FOR PRODUCING SAID ASSEMBLY

  • US 20090184090A1
  • Filed: 03/27/2009
  • Published: 07/23/2009
  • Est. Priority Date: 09/09/2003
  • Status: Abandoned Application
First Claim
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1. A method for for producing a thin-film assembly including at least one electronic thin-film component which is applied on a substrate by thin-film technology, characterized in that a printed circuit board with an insulation-material base body and a metal coating as the conductor layer is used, that the conductor layer is at least locally smoothed, optionally upon attachment of a reinforcement, in order to form at least one base electrode for the thin-film component, and that a contact layer is applied on the base electrode by thin-film technology prior to attaching the remaining thin-film component thereabove.

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