THIN-FILM ASSEMBLY AND METHOD FOR PRODUCING SAID ASSEMBLY

• US 20090184090A1
• Filed: 03/27/2009
• Published: 07/23/2009
• Est. Priority Date: 09/09/2003
• Status: Abandoned Application

• Current Assignee: AT&S Austria Technologie & Systemtechnik AG
• Original Assignee: AT&S Austria Technologie & Systemtechnik AG
• Inventors: Haslebner, Nikolai, Riedler, Manfred, Frosch, Ronald, WUCHSE, Markus, Leising, Cunther
• Application Number:
  US12/412,934
• Publication Number:
  US 20090184090A1
• Time in Patent Office: Days
• US Class Current: 216/13
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 2203/0392 Pretreatment of metal, e.g. before finish plating, etching
• CPC Class Codes: H05K 3/048 using a lift-off resist pattern or a release layer pattern
• CPC Class Codes: H05K 3/07 being removed electrolytically
• CPC Class Codes: H05K 3/244 Finish plating of conductors, especially of copper conductors, e.g. for pads or lands selective plating methods H05K3/243; finish plating of conductors made by printing techniques H05K3/246; solder as finish H05K3/3457, e.g. by plating H05K3/3473
• CPC Class Codes: H05K 3/383 by microetching
• CPC Class Codes: H05K 3/421 Blind plated via connections H05K3/422, H05K3/423 and H05K3/425 take precedence
• CPC Class Codes: H10K 59/179 Interconnections, e.g. wiring lines or terminals

Abstract

A thin-film assembly (1) including a substrate (2) and at least one electronic thin-film component (8) applied on the substrate by thin-film technology, wherein a base electrode (4) is provided on the substrate, on which base electrode thin-film layers (21) forming part of the thin-film component are arranged together with an upper top electrode (9); the substrate (2) is comprised of a printed circuit board (2) known per se and including an insulation-material base body (3) and a metal coating as the conductor layer (5), wherein the conductor layer (5) forms the base electrode (4) and, to this end, is smoothed at least on the location of the thin-film component (8), and wherein a contact layer (18) is applied by thin-film technology between the smoothed, optionally reinforced, conductor layer (5) and the superimposed thin-film layers (21) of the thin-film component (8), which contact layer is physically or chemically adsorbed on the surface of the base electrode (4).

Claims

1. A method for for producing a thin-film assembly including at least one electronic thin-film component which is applied on a substrate by thin-film technology, characterized in that a printed circuit board with an insulation-material base body and a metal coating as the conductor layer is used, that the conductor layer is at least locally smoothed, optionally upon attachment of a reinforcement, in order to form at least one base electrode for the thin-film component, and that a contact layer is applied on the base electrode by thin-film technology prior to attaching the remaining thin-film component thereabove.

2. A method according to claim 1, characterized in that the conductor layer is smoothed by a mechanical method such as, e.g., lapping, grinding or polishing.

3. A method according to claim 1, characterized in that the conductor layer is smoothed by electrochemical polishing.

4. A method according to claim 1, characterized in that the conductor layer is smoothed by chemicomechanical polishing.

5. A method according to claim 1, characterized in that the conductor layer is smoothed by chemical etching using, for instance, sulfuric acid, nitric acid or chromosulfuric acid.

6. A method according to claim 1, characterized in that the conductor layer is smoothed by ion etching.

7. A method according to claim 1, characterized in that the conductor layer is smoothed by bombardment with particles of individual or several atoms or molecules, such as, e.g, argon or argon clusters.

8. A method according to claim 1, characterized in that the conductor layer is smoothed over surface areas having the dimensions of 20×

20 μ

m² to a maximum mean surface roughness of 10 nm and, preferably, 3 nm.

9. A method according to claim 1, characterized in that the conductor layer is electrochemically reinforced.

10. A method according to claim 1, characterized in that the printed circuit board is temporarily passivated by photolitography in the remaining areas prior to locally reinforcing the conductor layer.

11. A method according to 1, characterized in that base body areas uncovered from the conductor layer are passivated by photolitographically assisted thin-film technology prior to attaching the remaining thin-film component.

12. A method according to 10, characterized in that a passivation layer is applied by thermal evaporation.

13. A method according to 10, characterized in that a passivation layer is applied by cold cathode coating.

14. A method according to 1, characterized in that a flexible printed circuit board is used as said substrate.

15. A method according to 14, characterized in that the flexible printed circuit board is temporarily supported, at least during smoothing, by a stiffened layer and/or by being guided over a table.

16. A method according to 1, characterized in that a flexible printed circuit board sheeting unwound from a reel is used.

17. A method according to 14, characterized in that a prefabricated flexible encapsulation sheeting is applied above the flexible printed circuit board sheeting provided with the thin-film component.

18. A method according to 17, characterized in that the encapsulation sheeting is unwound from a reel.