IC TESTING ENVIRONMENT INVESTIGATIVE DEVICE AND METHOD

• US 20090184719A1
• Filed: 06/09/2008
• Published: 07/23/2009
• Est. Priority Date: 01/18/2008
• Status: Abandoned Application

• Current Assignee: King Yuan Electronics Company Limited
• Original Assignee: King Yuan Electronics Company Limited
• Inventors: Ko, Hsuan-Chung, Hsieh, Chen-Yang
• Application Number:
  US12/135,983
• Publication Number:
  US 20090184719A1
• Time in Patent Office: Days
• US Class Current: 324/537
• CPC Class Codes: G01R 29/0814 Field measurements related to measuring influence on or from apparatus, components or humans EMC, EMI and similar testing in general G01R31/001, e.g. in ESD, EMI, EMC, EMP testing, measuring radiation leakage; detecting presence of micro- or radiowave emitters; dosimetry; testing shielding; measurements related to lightning
• CPC Class Codes: G01R 29/0821 rooms and test sites therefor, e.g. anechoic chambers, open field sites or TEM cells for testing antennas G01R29/105
• CPC Class Codes: G01R 31/002 where the device under test is an electronic circuit
• CPC Class Codes: G01R 31/2822 of microwave or radiofrequency circuits of attenuation, gain, e.g. using network analyzers G01R27/28
• CPC Class Codes: G01R 31/311 of integrated circuits G01R31/31728 takes precedence

Abstract

A device and method for investigating the IC (integrated circuit) testing environment is disclosed herein. The investigative device comprises a loadboard, a socket and an antenna. The loadboard is disposed in the bottom of the investigative device. The socket is disposed over the loadboard. The socket is used to fasten the element under test (such as IC) and the element under test is electrically connected to the loadboard. The antenna is also disposed in a position over the loadboard and closed to the socket. The purpose to dispose the antenna is to receive the wireless signal and monitor the testing environment if there is too much noise around the testing environment to jam the IC testing.

Claims

1. An investigative device for testing environment of circuits, comprising:

a loadboard;

a socket placed on said loadboard, and used to fasten an element under test so that said element under test is electrically connected to said loadboard; and

an antenna placed on said loadboard near said socket, and used for receiving a wireless signal.

2. The investigative device according to claim 1, wherein the ground of said antenna is electrically connected to the ground of said loadboard.

3. The investigative device according to claim 1, further comprising a frequency spectrum analyzer for analyzing the wireless signal transmitted from said antenna.

4. The investigative device according to claim 1, wherein said antenna is selected from the group consisting of a film antenna, a planar antenna or the combination thereof.

5. The investigative device according to claim 1, wherein said antenna is an inverted F antenna.

6. The investigative device according to claim 5, wherein said inverted F antenna is a planar inverted F antenna.

7. The investigative device according to claim 1, further comprising a testing program to analyze the wireless signal transmitted from said antenna.

8. The investigative device according to claim 1, wherein said element under test is a radio frequency integrated circuit.

9. A investigative method for testing environment of circuits, comprising:

placing an antenna on a loadboard;

receiving a wireless signal by said antenna; and

choosing one from a testing program and a frequency spectrum analyzer to analyze the wireless signal transmitted from said antenna.

10. The investigative method according to claim 9, wherein the ground of said antenna is electrically connected to the ground of said loadboard.

11. The investigative method according to claim 9, wherein said frequency spectrum analyzer is used to analyze the wireless signal transmitted from said antenna.

12. The investigative method according to claim 9, wherein said antenna is selected from the group consisting of a film antenna, a planar antenna or the combination thereof.

13. The investigative method according to claim 9, wherein said antenna is an inverted F antenna.

14. The investigative method according to claim 9, wherein said antenna is a planar inverted F antenna.

15. The investigative method according to claim 9, wherein said investigative method is for the testing of an integrated circuit.

16. The investigative method according to claim 9, wherein said antenna is used to scan the noise from the wireless network or the wireless mobile phone around the testing environment.

17. The investigative method according to claim 9, wherein said antenna is placed near a socket, and said socket is used to fasten said integrated circuit under test.

18. An investigative device for testing environment of integrated circuits, comprising:

a tester head;

a loadboard placed on and electrically connected to said tester head;

a socket placed on said loadboard, and used to fasten an element under test so that said element under test is electrically connected to said loadboard; and

an antenna placed on said loadboard near said socket, and used for receiving a wireless signal;

wherein said investigative device is used in a detecting machine.

19. The investigative device according to claim 18, wherein the ground of said antenna is electrically connected to the ground of said loadboard.

20. The investigative device according to claim 18, further comprising a frequency spectrum analyzer for analyzing the wireless signal transmitted from said antenna.

21. The investigative device according to claim 18, wherein said antenna is selected from the group consisting of a film antenna, a planar antenna or the combination thereof.

22. The investigative device according to claim 18, wherein said antenna is an inverted F antenna.

23. The investigative device according to claim 22, wherein said antenna is a planar inverted F antenna.

24. The investigative device according to claim 18, further comprising a testing program to analyze the wireless signal transmitted from said antenna.

25. The investigative device according to claim 18, wherein said element under test is a radio frequency integrated circuit.