APPARATUS AND METHODS FOR THERMAL MANAGEMENT OF LIGHT EMITTING DIODES

• US 20090185350A1
• Filed: 11/19/2008
• Published: 07/23/2009
• Est. Priority Date: 11/19/2007
• Status: Active Grant

• Current Assignee: Revolution Lighting Technologies, Inc.
• Original Assignee: Nexxus Lighting, Inc.
• Inventors: GRAJCAR, Zdenko
• Granted Patent: US 7,974,099 B2
• Time in Patent Office: Days
• US Class Current: 361/704
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10303 Pin-in-hole mounted pins

Abstract

An apparatus is disclosed that may include one or more printed circuit boards (PCBs) and an electronics package may be disposed about the first surface of one or more of the PCBs. The PCBs may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core(s). A plurality of PCB'"'"'s may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The apparatus may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these.

Claims

1. An apparatus comprising:

a first printed circuit board (PCB) that includes a first PCB first surface;

an electronics package configured to be disposed on the first PCB first surface;

a second PCB; and

a plurality of pins configured to secure the first PCB to the second PCB at an interval, the plurality of pins being further configured to form an array within the interval,

wherein at least a portion of the plurality of pins are connectable to the first PCB proximate the electronics package to receive at least a portion of heat generated by the electronics package and to conduct the portion of heat generated by the electronics package into the interval for dispersion.

2. The apparatus of claim 1, wherein the electronics package comprises at least one of:

a lighting device, a telecommunications device, a computer device, or a memory device.

3. The apparatus of claim 2, wherein the lighting device comprises a light emitting diode (LED).

4. The apparatus of claim 1, wherein the first PCB further includes a first PCB second surface, the first PCB comprises:

a first core that includes a first core first surface and a first core second surface;

a first metal layer configured to define a first trace disposed on the first core first surface; and

a second metal layer configured to define a second trace disposed on the first core second surface,

wherein the first core is interposed between the first metal layer and the second metal layer,

wherein the first trace is in electrical communication with the second trace, and

wherein the electronics package is in electrical communication with the first trace.

5. The apparatus of claim 4, wherein the second PCB includes a second PCB first surface and a second PCB second surface, the second PCB comprises:

a second core that includes a second core first surface and a second core second surface;

a third metal layer configured to define a third trace disposed on the second core first surface; and

a fourth metal layer configured to define a fourth trace disposed on the second core second surface,

wherein the core is interposed between the third metal layer and the fourth metal layer, and

wherein the third trace is in electrical communication with the fourth trace.

6. The circuit of claim 5, wherein the second PCB comprises a circuit driver that is in electrical communication with the third trace and the fourth trace.

7. The apparatus of claim 1, further comprising:

at least one power connector connected to the second PCB to communicate electric power from a source to the second PCB.

8. The apparatus of claim 5, wherein the plurality of pins pass from the first core first surface to the first core second surface to conduct heat generated by the electronics package through the first core and to disperse the heat from the array, and wherein at least one of the plurality of pins engages the third trace, the fourth trace, the first trace and the second trace such that the first trace and the second trace are in electrical communication with the third trace and the fourth trace, respectively.

9. The apparatus of claim 1, further comprising a housing to house the first PCB and the second PCB.

10. The apparatus of claim 9, wherein the housing comprises openings that permit air flow into the array for dissipating heat.

11. The apparatus according to claim 1, wherein at least one of the plurality of pins comprises a flat surface to permit air flow along the flat surface for heat dispersion.

12. The apparatus of claim 1, further comprising a pad disposed about the first PCB first surface, wherein the pad is in thermal communication with the electronic package.

13. The apparatus of claim 12, further comprising a heat slug disposed against the pad.

14. The apparatus of claim 13, wherein at least one of the plurality of pins contacts at least one of the pad and the slug.

15. An electrical device, comprising:

a first printed circuit board (PCB);

an electronics package disposed on the first PCB;

a second PCB spaced at an interval from the first PCB, the second PCB being configured to provide electrical power to the first PCB; and

a plurality of pins configured to secure the second PCB to the first PCB, wherein the plurality of pins are arranged proximate the electronics package to convey heat generated by the electronics package from the first PCB to the interval for dissipation.

16. The electrical device of claim 15, wherein at least one of the plurality of pins comprises a flat surface to permit air flow along the flat surface for dissipating the heat.

17. The electrical device of claim 15, wherein the electronics package comprises at least one light producing device.

18. The electrical device of claim 17, wherein the at least one light producing device comprises at least one light emitting diode (LED).

19. The electrical device of claim 15, further comprising a housing to house the first PCB and the second PCB.

20. The electrical device of claim 19, wherein the housing is configured to permit air flow into an interior of the housing past the plurality of pins and out of the housing to dissipate at least some of the generated heat.

21. The electrical device of claim 15, wherein the second PCB is configured to provide electrical power to the first PCB from an external source.

22. The electrical device of claim 15, wherein the second PCB includes one or more electronics packages.

23. The electrical device of claim 15, wherein the second PCB includes a driver circuit.

24. The electrical device of claim 15, wherein the electronics package includes at least one of:

a computer device, a memory, or a telecommunications device.