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Interconnection element for electric circuits

  • US 20090188706A1
  • Filed: 12/23/2008
  • Published: 07/30/2009
  • Est. Priority Date: 12/25/2007
  • Status: Active Grant
First Claim
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1. An interconnection element comprising:

  • a plurality of metal conductors;

    a plurality of solid metal bumps overlying and projecting in a first direction away from respective ones of the conductors, each bump having at least one edge bounding the bump in at least a second direction transverse to the first direction; and

    a low melting point (LMP) metal layer having a first face joined to the respective ones of the conductors and bounded in the second direction by at least one edge and a second face joined to the bumps,wherein the edges of the bumps and the LMP layer are aligned in the first direction, andwherein the LMP metal layer has a melting temperature substantially lower than the conductors.

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