METHOD OF CUTTING MATERIAL FOR USE IN IMPLANTABLE MEDICAL DEVICE
First Claim
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1. An apparatus for cutting a prosthetic segment, the apparatus comprising:
- a source material segment;
a support platform supporting the source material segment;
a beam assembly positioned to direct a beam at the source material segment; and
a motion system that controls the relative position of the support platform and the beam.
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Abstract
A method of cutting material for use in an implantable medical device employs a plotted laser cutting system. The laser cutting system is computer controlled and includes a laser combined with a motion system. The laser precisely cuts segments out of source material according to predetermined pattern as designated by the computer. The segments are used in constructing implantable medical devices. The cutting energy of the laser is selected so that the cut edges of the segments are melted to discourage delamination or fraying, but communication of thermal energy into the segment beyond the edge is minimized to avoid damaging the segment adjacent the edge.
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19 Claims
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1. An apparatus for cutting a prosthetic segment, the apparatus comprising:
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a source material segment;
a support platform supporting the source material segment;a beam assembly positioned to direct a beam at the source material segment; and
a motion system that controls the relative position of the support platform and the beam. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification