LIGHT-EMITTING DIODE LIGHT SOURCE

• US 20090189165A1
• Filed: 06/13/2008
• Published: 07/30/2009
• Est. Priority Date: 01/29/2008
• Status: Active Grant

• Current Assignee: Kingbright Electronic Co., Ltd.
• Original Assignee: Kingbright Electronic Co., Ltd.
• Inventors: SONG, Wen-Joe
• Granted Patent: US 7,931,387 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H05K 1/142 Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

An LED light source comprises a lower substrate having an upper surface which is formed with a groove and covered with an insulating layer in an area outside the groove, wherein the insulating layer is partially covered with a metal layer; an upper substrate disposed on a top of the insulating layer and formed with an opening in an area corresponding to the groove; a plurality of sub-substrates disposed on an inner bottom portion of the groove, wherein each said sub-substrate has a surface covered with a circuit layer, adjacent said sub-substrates are electrically connected to each other at respective adjacent ends thereof by a first metal lead, and each said sub-substrate is provided thereon with a plurality of LED chips, in which each said LED chip is connected by a second metal lead to a corresponding electrical connection point; and a light-transmitting colloid filled in the groove and the opening. The plurality of LED chips are thus integrally packaged in the groove to form the LED light source, which can be easily manufactured while having a small volume and providing high brightness.

Claims

1. A light-emitting diode (LED) light source, comprising:

a lower substrate, having an upper surface which is formed with a groove and covered with an insulating layer in an area outside the groove, wherein the insulating layer is partly covered with a metal layer for electrical connection;

an upper substrate, disposed on top of the insulating layer and formed with an opening in an area corresponding to the groove;

a plurality of sub-substrates, disposed on an inner bottom portion of the groove, wherein each said sub-substrate has a surface covered with a circuit layer, adjacent said sub-substrates are electrically connected to each other at respective adjacent ends thereof by a first metal lead, and each said sub-substrate is provided thereon with a plurality of LED chips, in which each said LED chip is connected by a second metal lead to a corresponding electrical connection point, and

a light-transmitting colloid filled in the groove and the opening.

2. The LED light source as claimed in claim 1, wherein the lower substrate is made of a metal having a high heat-conductivity.

3. The LED light source as claimed in claim 1, wherein the upper substrate is made of a metal having a high heat-conductivity.

4. The LED light source as claimed in claim 1, wherein the sub-substrates are made of a non-metal material.

5. The LED light source as claimed in claim 1, wherein the light-transmitting colloid contains a fluorescent substance.

6. The LED light source as claimed in claim 1, wherein the upper substrate and the lower substrate are bonded together with an insulating bonding material.

7. The LED light source as claimed in claim 1, wherein the lower substrate has two ends, and each of the two ends is formed with an inwardly extending semicircular via hole.

8. The LED light source as claimed in claim 1, wherein the sub-substrates are arranged so that a foremost end and a rearmost end of said arranged sub-substrates are each electrically connected to the metal layer by another said first metal lead.

9. The LED light source as claimed in claim 1, wherein the upper substrate, the lower substrate and the sub-substrates have a strip-shaped design.