METHOD AND SYSTEM FOR PACKAGING MEMS DEVICES WITH INCORPORATED GETTER
First Claim
Patent Images
1. An electromechanical system device package, comprising:
- a substrate;
an electromechanical device formed on the substrate;
a backplane; and
a seal positioned proximate to a perimeter of the electromechanical device, wherein the seal is in contact with the substrate and the backplane, and wherein the seal comprises glass.
3 Assignments
0 Petitions
Accused Products
Abstract
Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.
-
Citations
28 Claims
-
1. An electromechanical system device package, comprising:
-
a substrate; an electromechanical device formed on the substrate; a backplane; and a seal positioned proximate to a perimeter of the electromechanical device, wherein the seal is in contact with the substrate and the backplane, and wherein the seal comprises glass. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
-
13. A method of sealing an electromechanical system device package, comprising:
-
forming a seal between a substrate and a backplane, wherein the substrate comprises an electromechanical device formed thereon and the seal is formed proximate to a perimeter of the electromechanical device, and wherein the seal comprises glass; and attaching the substrate, the seal, and the backplane, thereby encapsulating the electromechanical device. - View Dependent Claims (14, 15)
-
-
16. A system for sealing an electromechanical system device package, comprising:
-
a substrate; an electromechanical device formed on the substrate; a backplane; and seal means positioned proximate to a perimeter of the electromechanical device, wherein the seal means is in contact with the substrate and the backplane, and wherein the seal means comprises glass. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
-
Specification