HOUSING, WIRELESS COMMUNICATION DEVICE USING THE HOUSING, AND MANUFACTURING METHOD THEREOF

• US 20090189818A1
• Filed: 01/15/2009
• Published: 07/30/2009
• Est. Priority Date: 01/30/2008
• Status: Active Grant

• Current Assignee: FIH (Hong Kong) Limited (Hon Hai Precision Industry Co., Ltd.), Shenzhen Futaihong Precision Industrial Company Limited (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: FIH (Hong Kong) Limited (Hon Hai Precision Industry Co., Ltd.), Shenzhen Futaihong Precision Industrial Company Limited (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Zhang, Bing, Yang, Fu-Keng, Zhan, Jian-Jun, Zeng, Yi-Ping
• Granted Patent: US 8,203,491 B2
• Time in Patent Office: Days
• US Class Current: 343/702
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material

Abstract

A housing for a wireless communication device includes a decorative film having an antenna pattern formed thereon, a protective coating covering the antenna pattern, and a substrate moldingly attached to the decorative film and the protective coating. The antenna pattern is a conductive ink coating. The antenna pattern and the protective coating are sandwiched between the decorative film and the substrate.

Claims

1. A housing for a wireless communication device, comprising:

a decorative film having an antenna pattern disposed thereon;

a protective coating covering the antenna pattern; and

a substrate attached to the decorative film and the protective coating;

wherein the antenna pattern is a conductive ink coating, the antenna pattern and the protective coating being sandwiched between the decorative film and the substrate.

2. The housing as claimed in claim 1, wherein the decorative film is polycarbonate, acrylonitrile-butadiene-styrene, polyethylene, polyethylene terephthalate, or poly propylene.

3. The housing as claimed in claim 1, wherein the substrate is moldable material of polycarbonate, acrylonitrile butadiene styrene, polyethylene, polyethylene terephthalate, or poly propylene, poly methyl methacrylate, or silicone.

4. The housing as claimed in claim 1, wherein the conductive ink coating has at least one of gold powder, silver powder, copper powder, carbon powder, and graphite powder mixed therein.

5. The housing as claimed in claim 1, wherein the antenna pattern is from 0.002 mm to 0.015 mm thick.

6. The housing as claimed in claim 1, wherein the protective coating is an ink coating from 0.002 mm to 0.015 mm thick.

7. A wireless communication device, comprising:

a main body comprising a printed circuit board therein, the printed circuit board comprising a conductive pole mounted thereon, sending and/or receiving electromagnetic waves; and

a housing mounted on the main body, comprising;

a decorative film having an antenna pattern formed thereon;

a protective coating covering the antenna pattern; and

a substrate moldingly attached to the decorative film and the protective coating;

wherein the antenna pattern is a conductive ink coating, the antenna pattern and the protective coating being sandwiched between the decorative film and the substrate.

8. The wireless communication device as claimed in claim 7, wherein the substrate is made of a moldable material selected from a group consisting of polycarbonate, acrylonitrile butadiene styrene, polyethylene, poly ethylene terephthalate, and poly propylene, poly methyl methacrylate, and silicone.

9. The wireless communication device as claimed in claim 7, wherein the gap between the conductive pole and the antenna pattern is less than 0.5 mm.

10. The wireless communication device as claimed in claim 7, wherein the flexible conductive pole of the printed circuit board enters into the through hole of the substrate and is in contact with the antenna pattern.

11. The wireless communication device as claimed in claim 7, wherein the conductive ink coating has at least one of gold powder, silver powder, copper powder, carbon powder, and graphite powder mixed therein.

12. The wireless communication device as claimed in claim 7, wherein the antenna pattern is from 0.002 mm to 0.015 mm thick.

13. The wireless communication device as claimed in claim 7, wherein the protective coating is an ink coating from 0.002 mm to 0.015 mm thick.

14. A method for manufacturing a housing for a wireless communication device, comprising:

providing a decorative film;

applying a conductive ink onto the decorative film to form an antenna pattern;

applying a protective coating onto the antenna pattern; and

forming a substrate attached to the decorative film and/or the protective coating via injection molding.

15. The method for manufacturing a housing as claimed in claim 14, wherein the decorative film is polycarbonate, acrylonitrile-butadiene-styrene, polyethylene, polyethylene terephthalate, or poly propylene.

16. The method for manufacturing a housing as claimed in claim 14, wherein the conductive ink coating has at least one of gold powder, silver powder, copper powder, carbon powder, and graphite powder mixed therein.

17. The method for manufacturing a housing as claimed in claim 14, wherein the antenna pattern is from 0.002 mm to 0.015 mm thick.

18. The method for manufacturing a housing as claimed in claim 14, wherein the protective coating is an ink coating from 0.002 mm to 0.015 mm thick.