HOUSING, WIRELESS COMMUNICATION DEVICE USING THE HOUSING, AND MANUFACTURING METHOD THEREOF

• US 20090189827A1
• Filed: 01/15/2009
• Published: 07/30/2009
• Est. Priority Date: 01/30/2008
• Status: Abandoned Application

• Current Assignee: FIH (Hong Kong) Limited (Hon Hai Precision Industry Co., Ltd.), Shenzhen Futaihong Precision Industrial Company Limited (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: FIH (Hong Kong) Limited (Hon Hai Precision Industry Co., Ltd.), Shenzhen Futaihong Precision Industrial Company Limited (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Zhang, Bing, Yang, Fu-Keng, Zhan, Jian-Jun, Zeng, Yi-Ping
• Application Number:
  US12/354,080
• Publication Number:
  US 20090189827A1
• Time in Patent Office: Days
• US Class Current: 343/872
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Abstract

A housing for a wireless communication device includes a substrate and an antenna circuit pattern formed on the substrate. The antenna circuit pattern is an electroplated metal coating.

Claims

1. A housing for a wireless communication device, comprising:

a substrate; and

an antenna circuit pattern disposed on the substrate;

wherein the antenna circuit pattern is an electroplated metal coating.

2. The housing as claimed in claim 1, wherein the substrate is acrylonitrile-butadiene-styrene, polycarbonate, or a mixture of acrylonitrile-butadiene-styrene and polycarbonate.

3. The housing as claimed in claim 1, wherein the substrate is silicone or glass.

4. A wireless communication device, comprising:

a main body comprising a printed circuit board therein, the printed circuit board comprising a conductive pole mounted thereon configured for sending and/or receiving electromagnetic waves; and

a housing mounted on the main body, comprising;

a substrate; and

an antenna circuit pattern disposed on the substrate;

wherein the antenna circuit pattern is an electroplated metal coating.

5. The wireless communication device as claimed in claim 4, wherein the substrate is acrylonitrile-butadiene-styrene, polycarbonate, or a mixture of acrylonitrile-butadiene-styrene and polycarbonate.

6. The wireless communication device as claimed in claim 4, wherein the substrate is silicone or glass.

7. The wireless communication device as claimed in claim 4, wherein the gap between the conductive pole 112 and the antenna circuit pattern 133 is less than 0.5 mm.

8. A method for manufacturing a housing for a wireless communication, comprising:

providing a substrate;

metalizing the substrate; and

electroplating a metal coating onto the substrate to form an antenna circuit pattern.

9. The method for manufacturing a housing as claimed in claim 8, wherein the substrate is acrylonitrile-butadiene-styrene, polycarbonate, or a mixture of acrylonitrile-butadiene-styrene and polycarbonate.

10. The method for manufacturing a housing as claimed in claim 8, wherein the substrate is silicone or glass.