HOUSING, WIRELESS COMMUNICATION DEVICE USING THE HOUSING, AND MANUFACTURING METHOD THEREOF
First Claim
Patent Images
1. A housing for a wireless communication device, comprising:
- a substrate; and
an antenna circuit pattern disposed on the substrate;
wherein the antenna circuit pattern is an electroplated metal coating.
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Abstract
A housing for a wireless communication device includes a substrate and an antenna circuit pattern formed on the substrate. The antenna circuit pattern is an electroplated metal coating.
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Citations
10 Claims
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1. A housing for a wireless communication device, comprising:
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a substrate; and an antenna circuit pattern disposed on the substrate; wherein the antenna circuit pattern is an electroplated metal coating. - View Dependent Claims (2, 3)
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4. A wireless communication device, comprising:
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a main body comprising a printed circuit board therein, the printed circuit board comprising a conductive pole mounted thereon configured for sending and/or receiving electromagnetic waves; and a housing mounted on the main body, comprising; a substrate; and an antenna circuit pattern disposed on the substrate; wherein the antenna circuit pattern is an electroplated metal coating. - View Dependent Claims (5, 6, 7)
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8. A method for manufacturing a housing for a wireless communication, comprising:
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providing a substrate; metalizing the substrate; and electroplating a metal coating onto the substrate to form an antenna circuit pattern. - View Dependent Claims (9, 10)
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Specification