Projection exposure apparatus, projection exposure method, and method for producing device

• US 20090190113A1
• Filed: 03/27/2009
• Published: 07/30/2009
• Est. Priority Date: 09/29/2003
• Status: Abandoned Application

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Nagahashi, Yoshitomo
• Application Number:
  US12/382,986
• Publication Number:
  US 20090190113A1
• Time in Patent Office: Days
• US Class Current: 355/53
• CPC Class Codes: G03F 7/70341 Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply chemical composition of immersion liquids G03F7/2041

Abstract

A projection exposure apparatus transfers a pattern formed on a mask onto a substrate via a projection optical system. The projection exposure apparatus includes electricity removal units which removes electricity from a liquid supplied to a space between the projection optical system and the surface of a substrate. This makes it possible to prevent destruction of the circuit pattern or malfunction of the device which would otherwise caused by charging of the liquid.

Claims

1. A projection exposure apparatus which transfers a pattern formed on a mask onto a substrate through a liquid, the projection exposure apparatus comprising:

a projection optical system which projects an image of the pattern onto the substrate; and

an electricity removal unit which removes electricity from the liquid to be supplied to a space between the projection optical system and a surface of the substrate.