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High power and high brightness diode-laser array for material processing applications

  • US 20090190218A1
  • Filed: 02/04/2009
  • Published: 07/30/2009
  • Est. Priority Date: 07/18/2006
  • Status: Active Grant
First Claim
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1. Optical apparatus, comprising:

  • a metal heat-sink; and

    a plurality of diode-laser assemblies, each of the thereof including only one diode-laser and a thermally conductive electrically insulating sub-mount having first and second surfaces perpendicular to each other, the diode-laser characterized as having a fast-axis, a slow-axis perpendicular to the fast axis, and a propagation axis perpendicular to both the fast-axis and the slow axis, and being bonded to the first surface of the sub-mount; and

    wherein each of the diode-laser assemblies is bonded via the second surface of the sub-mount thereof to the heat sink with the propagation axes of the diode-lasers being about parallel to each other and with fast-axes of the diode-lasers aligned in the fast-axis direction.

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