PELLICLE FRAME

• US 20090191470A1
• Filed: 07/21/2008
• Published: 07/30/2009
• Est. Priority Date: 07/19/2007
• Status: Abandoned Application

• Current Assignee: Shin-Etsu Chemical Company Limited
• Original Assignee: Shin-Etsu Chemical Company Limited
• Inventors: Shirasaki, Toru
• Application Number:
  US12/176,693
• Publication Number:
  US 20090191470A1
• Time in Patent Office: Days
• US Class Current: 430/5
• CPC Class Codes: G03F 1/62 Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
• CPC Class Codes: G03F 1/64 characterised by the frames, e.g. structure or material, including bonding means therefor

Abstract

The present invention is directed to provide a pellicle that can control the deformation of the photomask to a minimum without particular consideration of the flatness of a pellicle frame even in the case where a pellicle is affixed to a photomask for lithography. In the pellicle of the present invention, a cross-sectional area of a pellicle frame is 6 mm² or less. In the pellicle of the present invention, a pellicle frame is made of a material having a Young'"'"'s modulus of 50 GPa or less.

Claims

1. A pellicle used in semiconductor lithography, characterized in that a cross-sectional area of a pellicle frame is 6 mm² or less.

2. A pellicle used in semiconductor lithography, characterized in that a pellicle frame is made of a material having a Young'"'"'s modulus of 50 GPa or less.