Sensing Structure

• US 20090194342A1
• Filed: 06/18/2008
• Published: 08/06/2009
• Est. Priority Date: 02/04/2008
• Status: Active Grant

• Current Assignee: AU Optronics Corporation
• Original Assignee: AU Optronics Corporation
• Inventors: Su, Cheng Yi, Kuo, Han Ping
• Granted Patent: US 8,269,940 B2
• Time in Patent Office: Days
• US Class Current: 178/18.03
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: G06F 3/045 using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 1/147 at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence
• CPC Class Codes: H05K 2201/052 Branched

Abstract

A sensing structure is provided. The sensing structure includes a first substrate, a second substrate, a sensing unit, and a flexible printed circuit (FPC). The sensing unit is disposed on the first substrate and adapted to generate a signal when the sensing unit is touched. The FPC has a first end and a second end. The first end includes a first connecting portion and a second connecting portion. The first connecting portion is disposed on the first substrate and electrically connected to the sensing unit, and the second connecting portion connects to the second substrate.

Claims

1. A sensing structure, comprising:

a first substrate;

a second substrate disposed under the first substrate;

a sensing unit disposed on the first substrate and adapted to generate a sensing signal when the sensing unit is touched; and

a flexible printed circuit having a first end and a second end, the first end including a first connecting portion and a second connecting portion, wherein the first connecting portion is disposed on the first substrate and electrically connects to the sensing unit, and the second connecting portion connects to the second substrate.

2. The sensing structure as claimed in claim 1, wherein the second end of the flexible printed circuit has a third connecting portion electrically connecting to a signal processing system.

3. The sensing structure as claimed in claim 2, wherein the sensing signal is transmitted to the signal processing system through the first connecting portion and the third connecting portion.

4. The sensing structure as claimed in claim 2, further comprising a sensing chip disposed on the second substrate and electrically connected to the sensing unit through the second connecting portion and the first connecting portion.

5. The sensing structures as claimed in claim 4, wherein the sensing chip is electrically connected to the signal processing system through the second connecting portion and the third connecting portion.

6. The sensing structure as claimed in claim 4, wherein the sensing signal is transmitted to the sensing chip through the first connecting portion and the second connecting portion.

7. The sensing structure as claimed in claim 1, wherein the sensing structure has an active area, and the sensing unit covers at least part of the active area.

8. The sensing structure as claimed in claim 2, further comprising a driving chip disposed on the second substrate and electrically connected to the signal processing system through the second connecting portion and the third connecting portion.

9. The sensing structure as claimed in claim 8, wherein the sensing signal is transmitted to the driving chip through the first connecting portion and the second connecting portion.

10. The sensing structure as claimed in claim 8, wherein a driving signal from the signal processing system is transmitted to the driving chip through the third connecting portion and the second connecting portion.

11. The sensing structure as claimed in claim 1, further comprising another second connecting portion, wherein the first connecting portion is located between the second connecting portion and the another second connecting portion.

12. The sensing structure as claimed in claim 1, wherein the sensing unit is a touch unit integrated with a display.

13. The sensing structure as claimed in claim 1, wherein the sensing unit is integrated onto an upper surface of the first substrate.

14. The sensing structure as claimed in claim 13, wherein the sensing unit comprises a conductive layer which is formed on the upper surface of the first substrate.

15. The sensing structure as claimed in claim 14, wherein the conductive layer is made of indium tin oxide.

16. The sensing structure as claimed in claim 14, wherein the sensing unit includes a passivation layer overlaying the conductive layer.

17. The sensing structure as claimed in claim 16, wherein the passivation layer is made of silicon nitride.

18. The sensing structure as claimed in claim 16, wherein the passivation layer comprises a polarizer.

19. The sensing structure as claimed in claim 1, wherein the sensing unit comprises a touch panel.

20. The sensing structure as claimed in claim 1, wherein the sensing unit comprises a capacitance sensing unit or a resistance sensing unit.