MEMS Packaging Including Integrated Circuit Dies

• US 20090194829A1
• Filed: 11/12/2008
• Published: 08/06/2009
• Est. Priority Date: 01/31/2008
• Status: Abandoned Application

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Chung, Shine, Hsueh, Fu-Lung
• Application Number:
  US12/269,298
• Publication Number:
  US 20090194829A1
• Time in Patent Office: Days
• US Class Current: 257/415
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
• CPC Class Codes: B81C 2203/0792 Forming interconnections between the electronic processing unit and the micromechanical structure
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73257 Bump and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/19107 off-chip wires

Abstract

MEMS packaging schemes having a system-on-package (SOP) configuration and a system-on-board (SOB) configuration are provided. The MEMS package comprises one or more MEMS dies, a cap section having one or more integrated circuit (IC) dies, and a packaging substrate or a printed circuit board (PCB) arranged in a stacking manner. Vertical connectors, such as through-silicon-vias (TSVs), are formed to provide short electrical connections between the various components. The MEMS packaging schemes enable higher integration density, reduced MEMS package footprints, reduced RC delays and power consumption.

Claims

1. A micro-electromechanical system (MEMS), comprising:

a MEMS device having a first plurality of terminals; and

a cap section including at least one pass-through via and at least one microelectronic device, and a second plurality of terminals;

wherein the MEMS device and the cap section are electrically coupled through the first plurality and the second plurality of terminals.

2. The MEMS of claim 1, further including a seal ring formed in a space between the MEMS device and the cap section, the seal ring enclosing a projected sensor portion of the MEMS device.

3. The MEMS of claim 1, being selected from the group consisting of an RF switch, a microphone, a speaker, an inertial sensor, a pressure sensor, an RF tunable device, a relay, and any combinations thereof.

4. The MEMS of claim 1, wherein the cap section comprises at least one of a digital IC, an analog IC, a MEMS control IC, a mixed-signal IC, a microprocessor, a memory IC, an IC in a system-on-a-chip configuration, a micro-strip filter, a micro-strip resonator, and any combination thereof.

5. The MEMS of claim 1, wherein the cap section comprises a material selected from the group consisting essentially of:

semiconductor material, ceramic, glass, plastic, and any combination thereof.

6. The MEMS of claim 1, wherein a pitch of the at least one pass-through via is significantly greater than that of the first plurality of terminals.

7. The MEMS of claim 1, further comprising a packaging substrate wherein the MEMS device, the cap section, and the packaging substrate are arranged in a stacking manner, forming a system-on-package (SOP) configuration.

8. The MEMS of claim 1, further comprising a printed circuit board (PCB) wherein the MEMS device, the cap section, and the PCB are arranged in a stacking manner, forming a system-on-board (SOB) configuration.

9. An apparatus, comprising:

a micro-electromechanical system (MEMS) device comprising at least one electronic circuit, the at least one electronic circuit being electrically coupled to at least one terminal on a first surface of the MEMS device;

a cap section underlying the MEMS device comprising at least one semiconductor device, wherein the at least one semiconductor device is electrically coupled to the at least one electronic circuit in the MEMS device through the at least one terminal on the MEMS device, and wherein the at least one semiconductor device is also electrically coupled to at least one contact on a first connecting surface of the cap section through internal metal interconnections and at least one pass-through via in the cap section; and

a substrate underlying the cap section comprising at least one contact on a supporting surface.

10. The apparatus of claim 9, further including an enclosure formed in a space between the MEMS device and the cap section, the enclosure being sealed by a seal ring and housing a projected sensor portion of the MEMS device.

11. The apparatus of claim 9, wherein the at least one semiconductor device in the cap section comprises a digital IC, an analog IC, a MEMS control IC, a mixed-signal IC, a microprocessor, a memory IC, an IC in a system-on-a-chip configuration, a micro-strip filter, a micro-strip resonator, and any combination thereof.

12. The apparatus of claim 9, wherein the at least one electronic circuit in the MEMS is coupled to the at least one contact on the supporting surface through internal metal interconnections and the at least one pass-through via in the cap section.

13. The apparatus of claim 9, wherein a pitch of the at least one pass-through via is significantly greater than that of the at least one terminal on the first surface of the MEMS device.

14. The apparatus of claim 9, further comprising a sensor portion projecting over a portion of a second surface of the MEMS device.

15. The apparatus of claim 9, further comprising an interposer between the cap section and the supporting surface, adapting the at least one contact on the first connecting surface of the cap section to the at least one contact on the supporting surface of the substrate.

16. The apparatus of claim 9, wherein the substrate is a packaging substrate, the packaging substrate including a plurality of package leads coupled to the at least one contact on the packaging substrate.

17. The apparatus of claim 9, wherein the substrate is a printed circuit board (PCB) comprising at least one circuit element, the at least one circuit element in the PCB being electrically coupled to the at least one semiconductor device in the cap section through metal traces in the PCB.

18. The apparatus of claim 9, further including at least one bond pad on a second surface of the MEMS device, at least one bond pad on a second connecting surface of the cap section, and at least one bond pad on the supporting surface;

wherein the bond pads are electrically coupled through wire bonds.

19. The apparatus of claim 9, wherein the cap section has a multi-cap-layers configuration, and each of the cap layers comprises at least one pass-through via, a digital IC, an analog IC, a MEMS control IC, a mixed-signal IC, a microprocessor, a memory IC, an IC in a system-on-a-chip configuration, a micro-strip filter, a micro-strip resonator, and any combination thereof.

20. The apparatus of claim 19, wherein a pitch of the at least one pass-through via in the multi-cap-layers is different.