SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHIELDING
First Claim
1. A semiconductor device package, comprising:
- a substrate unit includingan upper surface,a lower surface,a lateral surface disposed adjacent to a periphery of the substrate unit, anda grounding element disposed adjacent to the periphery of the substrate unit, the grounding element corresponding to a remnant of a grounding via and including a connection surface that is electrically exposed adjacent to the lateral surface of the substrate unit;
a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit;
a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device, the package body including exterior surfaces that include a lateral surface, the lateral surface of the package body being substantially aligned with the lateral surface of the substrate unit; and
an electromagnetic interference shield disposed adjacent to the exterior surfaces of the package body and electrically connected to the connection surface of the grounding element,wherein the grounding clement provides an electrical pathway to ground electromagnetic emission-s incident upon the electromagnetic interference shield.
1 Assignment
0 Petitions
Accused Products
Abstract
Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element disposed adjacent to a periphery of the substrate unit; (2) a semiconductor device disposed adjacent to an upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a connection surface of the grounding element. A lateral surface of tile package body is substantially aligned with a lateral surface of the substrate unit, and the connection surface of the grounding element is electrically exposed adjacent to the lateral surface of the substrate unit. The grounding element corresponds to a remnant of a grounding via, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.
163 Citations
23 Claims
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1. A semiconductor device package, comprising:
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a substrate unit including an upper surface, a lower surface, a lateral surface disposed adjacent to a periphery of the substrate unit, and a grounding element disposed adjacent to the periphery of the substrate unit, the grounding element corresponding to a remnant of a grounding via and including a connection surface that is electrically exposed adjacent to the lateral surface of the substrate unit; a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device, the package body including exterior surfaces that include a lateral surface, the lateral surface of the package body being substantially aligned with the lateral surface of the substrate unit; and an electromagnetic interference shield disposed adjacent to the exterior surfaces of the package body and electrically connected to the connection surface of the grounding element, wherein the grounding clement provides an electrical pathway to ground electromagnetic emission-s incident upon the electromagnetic interference shield. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A semiconductor device package, comprising:
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a substrate unit including a first surface, a second opposing surface, and a grounding element at least partially extending between the first surface and the second opposing surface, the grounding element including a lateral surface disposed adjacent to a periphery of the substrate unit; a semiconductor device disposed adjacent to the first surface of the substrate unit and electrically connected to the substrate unit; a package body disposed adjacent to the first surface of the substrate unit and covering the semiconductor device and the grounding element, such that the lateral surface of the grounding element is electrically exposed, the package body including exterior surfaces; and an electromagnetic interference shield disposed adjacent to the exterior surfaces of the package body and electrically connected to the lateral surface of the grounding element, wherein the grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the electromagnetic interference shield, and wherein a lateral profile of the semiconductor device package is substantially planar and is substantially orthogonal with respect to the second opposing surface of the substrate unit. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16)
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17. A method of forming a semiconductor device package, comprising:
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providing a substrate including an upper surface, a lower surface, and grounding vias at least partially extending between the upper surface and the lower surface; electrically connecting a semiconductor device to the upper surface of the substrate; applying a molding material to the upper surface of the substrate to form a molded structure covering the grounding vias and the semiconductor device; forming cutting slits extending through the molded structure and the substrate, the cutting slits being aligned with the substrate, such that;
(a) the substrate is sub-divided to form a substrate unit;
(b) the molded structure is sub-divided to form a package body disposed adjacent to the substrate unit, the package body including exterior surfaces; and
(c) remnants of the grounding vias correspond to grounding elements disposed adjacent to a periphery of the substrate unit, each of the grounding elements including an exposed connection surface; andapplying an electromagnetic interference coating to the exterior surfaces of the package body and the connection surfaces of the grounding elements to form an electromagnetic interference shield. - View Dependent Claims (18, 19, 20, 21, 22, 23)
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Specification