SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHIELDING
First Claim
1. A semiconductor device package, comprising:
- a substrate unit including an upper surface, a lower surface, and a lateral surface disposed adjacent to a periphery of the substrate unit;
a grounding element disposed adjacent to the periphery of the substrate unit and extending upwardly from the upper surface of the substrate unit, the grounding element corresponding to a remnant of a conductive bump and including a lateral surface;
a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit;
a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device and the grounding element, such that the lateral surface of the grounding element is electrically exposed, the package body including exterior surfaces that include a lateral surface, the lateral surface of the package body being substantially aligned with the lateral surface of the substrate unit; and
an electromagnetic interference shield disposed adjacent to the exterior surfaces of the package body and electrically connected to the lateral surface of the grounding element,wherein the grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the electromagnetic interference shield.
1 Assignment
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Accused Products
Abstract
Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) a grounding element disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface; (4) a package body disposed adjacent to the upper surface and covering the semiconductor device and the grounding element; and (5) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a lateral surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The grounding element corresponds to a remnant of a conductive bump, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.
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Citations
27 Claims
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1. A semiconductor device package, comprising:
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a substrate unit including an upper surface, a lower surface, and a lateral surface disposed adjacent to a periphery of the substrate unit; a grounding element disposed adjacent to the periphery of the substrate unit and extending upwardly from the upper surface of the substrate unit, the grounding element corresponding to a remnant of a conductive bump and including a lateral surface; a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device and the grounding element, such that the lateral surface of the grounding element is electrically exposed, the package body including exterior surfaces that include a lateral surface, the lateral surface of the package body being substantially aligned with the lateral surface of the substrate unit; and an electromagnetic interference shield disposed adjacent to the exterior surfaces of the package body and electrically connected to the lateral surface of the grounding element, wherein the grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the electromagnetic interference shield. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A semiconductor device package, comprising:
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a substrate unit including a first surface, a second opposing surface, and a grounding pad disposed adjacent to the first surface; a grounding element extending upwardly from the grounding pad and electrically connected to the grounding pad, the g-rounding element including a connection surface disposed adjacent to a periphery of the substrate unit; a semiconductor device disposed adjacent to the first surface of the substrate unit and electrically connected to the substrate unit; a package body disposed adjacent to the first surface of the substrate unit and covering the semiconductor device and the grounding element, such that the connection surface of the grounding element is electrically exposed, the package body including exterior surfaces; and an electromagnetic interference shield disposed adjacent to the exterior surfaces of the package body and electrically connected to the connection surface of the grounding element, wherein the grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the electromagnetic interference shield. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method of forming a semiconductor device package, comprising:
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providing a substrate including an upper surface, a lower surface, and contact pads disposed adjacent to the upper surface; electrically connecting a semiconductor device to the upper surface of the substrate; applying an electrically conductive material to the upper surface of the substrate to form conductive bumps disposed adjacent to respective ones of the contact pads; applying a molding material to the upper surface of the substrate to form a molded structure covering the conductive bumps and the semiconductor device; forming cutting slits extending through the molded structure and the substrate, the cutting slits being aligned with the substrate, such that;
(a) the substrate is subdivided to form a substrate unit;
(b) the molded structure is sub-divided to form a package body disposed adjacent to the substrate unit, the package body including exterior surfaces; and
(c) remnants of the conductive bumps correspond to grounding elements disposed adjacent to a periphery of the substrate unit, each of the grounding elements including an exposed lateral surface; andapplying an electromagnetic interference coating to the exterior surfaces of the package body and the lateral surfaces of the grounding elements to form an electromagnetic interference shield. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27)
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Specification