POWER CAPACITOR

• US 20090195957A1
• Filed: 04/13/2006
• Published: 08/06/2009
• Est. Priority Date: 05/02/2005
• Status: Active Grant

• Current Assignee: TDK Electronics AG (TDK Corporation)
• Original Assignee: Epcos AG (TDK Corporation)
• Inventors: Hübscher, Wilhelm, Vetter, Harald, Grimm, Wilhelm
• Granted Patent: US 8,339,767 B2
• Time in Patent Office: Days
• US Class Current: 361/272
• CPC Class Codes: H01G 2/106 Fixing the capacitor in a housing
• CPC Class Codes: H01G 9/06 Mounting in containers
• CPC Class Codes: H01G 9/08 Housing; Encapsulation

Abstract

A power capacitor is described herein. The power capacitor includes a housing and at least one capacitor winding. The power capacitor also includes at least one mechanical spring clement between the housing and the at least one capacitor winding.

Claims

1. A power capacitor, comprising:

a housing,

at least one capacitor winding, and

at least one mechanical spring element between the housing and the at least one capacitor winding.

2. The power capacitor of claim 1,

wherein the at least one mechanical spring element comprises a springe pad.

3. The power capacitor of claim 1, wherein the at least one mechanical spring element is on each of two opposing sides of the at least one capacitor winding.

4. The power capacitor of claim 1, further comprising a profiled insulating shell between the at least one capacitor winding, and the housing for mechanical fixing of the spring element.

5. A module for power electronics, comprising:

a capacitor including a trough-shaped housing and at least one capacitor winding,

at least one mechanical spring element on a base of the housing, and

an electrical unit,

wherein the capacitor is mounted on a base region of the electrical unit, and

wherein the spring element is configured to press the at least one capacitor winding onto the base region of the electrical unit.

6. The module of claim 5, further comprising a cooling plate in thermal contact with a cooling surface of the capacitor formed by a current rail on the base of the electrical unit.

7. The module of claim 6, further comprising an electrical insulating film on a side of the cooling surface facing the electrical unit.

8. The module of claim 5, further comprising IGBTs.