POLYIMIDE FILM, AND METHOD FOR PRODUCTION THEREOF

• US 20090197068A1
• Filed: 01/30/2009
• Published: 08/06/2009
• Est. Priority Date: 02/01/2008
• Status: Abandoned Application

• Current Assignee: UBE Industries Limited
• Original Assignee: UBE Industries Limited
• Inventors: Kohda, Masafumi, Yamaguchi, Hiroaki, Hisano, Nobuharu, Yabunaka, Shinsuke
• Application Number:
  US12/363,546
• Publication Number:
  US 20090197068A1
• Time in Patent Office: Days
• US Class Current: 428/220
• CPC Class Codes: B32B 15/08 of synthetic resin
• CPC Class Codes: B32B 15/20 comprising aluminium or copper B32B15/016 and B32B15/017 take precedence
• CPC Class Codes: B32B 2307/20 having particular electrical or magnetic properties, e.g. piezoelectric
• CPC Class Codes: B32B 2307/306 Resistant to heat
• CPC Class Codes: B32B 2307/50 having particular mechanical properties
• CPC Class Codes: B32B 2307/54 Yield strength; Tensile strength
• CPC Class Codes: B32B 2307/714 Inert, i.e. inert to chemical degradation, corrosion
• CPC Class Codes: B32B 2307/724 Permeability to gases, adsorption
• CPC Class Codes: B32B 2307/734 Dimensional stability
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 2457/04 Insulators
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 2457/12 Photovoltaic modules
• CPC Class Codes: B32B 27/16 specially treated, e.g. irradiated
• CPC Class Codes: B32B 27/281 comprising polyimides
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: C08G 73/1042 Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
• CPC Class Codes: C08G 73/1067 Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
• CPC Class Codes: C08L 79/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: H05K 1/0346 containing N
• CPC Class Codes: H05K 2201/0154 : Polyimide
• CPC Class Codes: Y10T 428/31681 : Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Abstract

Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component consisting essentially of 3,3′,4,4′-biphenyltetracarboxylic dianhydride and an aromatic diamine component consisting essentially of not less than 65 mol phenylenediamine % but less than 97 mol % of p-phenylenediamine and not less than 3 mol % but less than 35 mol % of 2,4-toluenediamine.

Claims

1. A polyimide film prepared from an aromatic tetracarboxylic acid component comprising 3,3′

,4,4′

-biphenyltetracarboxylic dianhydride as a main component and an aromatic diamine component comprising p-phenylenediamine as a main component;

wherein

the aromatic diamine component comprises not less than 3 mol % but less than 35 mol % of 2,4-toluenediamine based on the total molar quantity of the aromatic diamine component.

2. The polyimide film as claimed in claim 1, wherein the aromatic diamine component comprises 5 mol % to 30 mol % of 2,4-toluenediamine based on the total molar quantity of the aromatic diamine component.

3. The polyimide film as claimed in claim 1, wherein the polyimide film has a thickness of 3 μ

m to 250 μ

m.

4. The polyimide film as claimed in claim 1, wherein the polyimide film has a thickness of 75 μ

m to 250 μ

m.

5. A process for producing a polyimide film as claimed in claim 1, comprising steps of:

providing a solution of a polyimide precursor prepared from an aromatic tetracarboxylic acid component consisting essentially of 3,3′

,4,4′

-biphenyltetracarboxylic dianhydride and an aromatic diamine component consisting essentially of not less than 65 mol % but less than 97 mol % of p-phenylenediamine and not less than 3 mol % but less than 35 mol % of 2,4-toluenediamine;

flow-casting the solution of the polyimide precursor on a support and heating it, thereby preparing a self-supporting film of a polyimide precursor solution; and

heating the self-supporting film to effect imidization.

6. The process for producing a polyimide film as claimed in claim 5, wherein the solution of the polyimide precursor which is flow-casted on a support has a solid content of 18 wt % to 30 wt %.

7. The process for producing a polyimide film as claimed in claim 5, wherein the self-supporting film produced has an initial elastic modulus of 500 MPa or higher.

8. A copper-laminated polyimide film, wherein a copper foil is laminated on the surface of the polyimide film as claimed in claim 1 via an adhesive layer or a thermocompression-bonding layer.

9. The copper-laminated polyimide film as claimed in claim 8, wherein the copper-laminated polyimide film has a 90°

peel strength of 0.3 N/mm or higher.