WIRING SUBSTRATE FOR ELECTRONIC-COMPONENT INSPECTION APPARATUS

• US 20090200067A1
• Filed: 02/02/2009
• Published: 08/13/2009
• Est. Priority Date: 02/04/2008
• Status: Abandoned Application

• Current Assignee: NGK Spark PLUG Company Limited (Niterra Co., Ltd.)
• Original Assignee: NGK Spark PLUG Company Limited (Niterra Co., Ltd.)
• Inventors: Nozu, Kazuya
• Application Number:
  US12/364,174
• Publication Number:
  US 20090200067A1
• Time in Patent Office: Days
• US Class Current: 174/255
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/114 Pad being close to via, but not surrounding the via
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence
• CPC Class Codes: H05K 3/4629 laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Abstract

A wiring substrate K for an electronic-component inspection apparatus includes a substrate body (1) composed of a plurality of stacked ceramic layers s1 to s8 and having a front surface (2) and a back surface (3); and front-surface terminal electrodes f formed on the front surface (2) of the substrate body (1). Unit inspection patterns a1, individual ones of which are constituted by a plurality of the front-surface terminal electrodes f disposed to correspond to a plurality of terminal electrodes m of a single electronic component cn to be inspected, are regularly disposed in vertical and horizontal directions as viewed from above such that the centroids g of the unit inspection patterns a1 coincide with alternate ones of intersections j between vertical imaginary lines L1 to L3 and horizontal imaginary lines N1 to N4 passing through the centroids g of the unit inspection patterns a1.

Claims

1. A wiring substrate for an electronic-component inspection apparatus comprising:

a substrate body composed of a plurality of stacked ceramic layers, said substrate body having a front surface and a back surface; and

front-surface terminal electrodes formed on the front surface of the substrate body, and grouped into unit inspection patterns, individual ones of the unit inspection patterns being constituted by a plurality of the front-surface terminal electrodes disposed so as to correspond to a plurality of terminal electrodes of individual electronic components to be inspected,

wherein said unit inspection patterns are disposed so as to be offset distance-wise from a lattice arrangement in at least one of orthogonal first and second directions, as viewed from above the front surface of the substrate body.

4. The wiring substrate for an electronic-component inspection apparatus according to claim 1, wherein some of the front-surface terminal electrodes each includes at least an inspection pad formed inside an associated unit inspection pattern, a cover pad connected to a via conductor exposed to the front surface of the substrate body, and a connection wiring trace which connects the inspection pad and the cover pad.

7. The wiring substrate for an electronic-component inspection apparatus according to claim 4, wherein individual ones of the unit inspection patterns have a rectangular shape as viewed from above the front surface of the substrate body;

a plurality of inspection pads are formed along all sides of respective unit inspection patterns;

cover pads individually connected to the inspection pads via dedicated connection wiring traces are formed in an area surrounded by the inspection pads associated with an unit inspection pattern or outside an associated unit inspection pattern; and

the cover pads are connected to via conductors which pass through at least an uppermost ceramic layer which forms the front surface of the substrate body.

10. The wiring substrate for an electronic-component inspection apparatus according to claim 4, wherein the cover pads are larger than the inspection pads.

13. The wiring substrate for an electronic-component inspection apparatus according to claim 4, wherein the cover pads are larger in diameter than the via conductors to which the cover pads are connected.

16. The wiring substrate for an electronic-component inspection apparatus according to claim 4, wherein the diameter of the cover pads is at least 2.5 times the diameter of the via conductors.

2. A wiring substrate for an electronic-component inspection apparatus comprising:

a substrate body composed of a plurality of stacked ceramic layers, said substrate body having a front surface and a back surface; and

front-surface terminal electrodes formed on the front surface of the substrate body, and grouped into unit inspection patterns, individual ones of the unit inspection patterns being constituted by a plurality of the front-surface terminal electrodes disposed so as to correspond to a plurality of terminal electrodes of individual electronic components to be inspected,

wherein said unit inspection patterns are disposed so as to be offset distance-wise from a lattice arrangement of rows and columns in at least one of orthogonal first and second directions, as viewed from above the front surface of the substrate body, wherein the unit inspection patterns are arranged in every other row but not in alternate rows in at least one of the first and second directions.

5. The wiring substrate for an electronic-component inspection apparatus according to claim 2, wherein some of the front-surface terminal electrodes each includes at least an inspection pad formed inside an associated unit inspection pattern, a cover pad connected to a via conductor exposed to the front surface of the substrate body, and a connection wiring trace which connects the inspection pad and the cover pad.

8. The wiring substrate for an electronic-component inspection apparatus according to claim 5, wherein individual ones of the unit inspection patterns have a rectangular shape as viewed from above the front surface of the substrate body;

a plurality of inspection pads are formed along all sides of respective unit inspection patterns;

cover pads individually connected to the inspection pads via dedicated connection wiring traces are formed in an area surrounded by the inspection pads associated with an unit inspection pattern or outside an associated unit inspection pattern; and

the cover pads are connected to via conductors which pass through at least an uppermost ceramic layer which forms the front surface of the substrate body.

11. The wiring substrate for an electronic-component inspection apparatus according to claim 5, wherein the cover pads are larger than the inspection pads.

14. The wiring substrate for an electronic-component inspection apparatus according to claim 5, wherein the cover pads are larger in diameter than the via conductors to which the cover pads are connected.

17. The wiring substrate for an electronic-component inspection apparatus according to claim 5, wherein the diameter of the cover pads is at least 2.5 times the diameter of the via conductors.

3. A wiring substrate for an electronic-component inspection apparatus comprising:

a substrate body composed of a plurality of stacked ceramic layers, said substrate body having a front surface and a back surface; and

front-surface terminal electrodes formed on the front surface of the substrate body, and grouped into unit inspection patterns, individual ones of the unit inspection patterns being constituted by a plurality of the front-surface terminal electrodes disposed so as to correspond to a plurality of terminal electrodes of individual electronic components to be inspected,

wherein said unit inspection patterns are regularly arranged in orthogonal first and second directions, as viewed from above the front surface of the substrate body, such that centroids of the respective unit inspection patterns coincide with alternate ones of intersections between first imaginary lines and second imaginary lines extending along the first and second directions, respectively, and passing through the centroids of the unit inspection patterns.

6. The wiring substrate for an electronic-component inspection apparatus according to claim 3, wherein some of the front-surface terminal electrodes each includes at least an inspection pad formed inside an associated unit inspection pattern, a cover pad connected to a via conductor exposed to the front surface of the substrate body, and a connection wiring trace which connects the inspection pad and the cover pad.

9. The wiring substrate for an electronic-component inspection apparatus according to claim 6, wherein individual ones of the unit inspection patterns have a rectangular shape as viewed from above the front surface of the substrate body;

a plurality of inspection pads are formed along all sides of respective unit inspection patterns;

cover pads individually connected to the inspection pads via dedicated connection wiring traces are formed in an area surrounded by the inspection pads associated with an unit inspection pattern or outside an associated unit inspection pattern; and

the cover pads are connected to via conductors which pass through at least an uppermost ceramic layer which forms the front surface of the substrate body.

12. The wiring substrate for an electronic-component inspection apparatus according to claim 6, wherein the cover pads are larger than the inspection pads.

15. The wiring substrate for an electronic-component inspection apparatus according to claim 6, wherein the cover pads are larger in diameter than the via conductors to which the cover pads are connected.

18. The wiring substrate for an electronic-component inspection apparatus according to claim 6, wherein the diameter of the cover pads is at least 2.5 times the diameter of the via conductors.