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CHIP-TYPE LED PACKAGE AND LIGHT EMITTING APPARATUS HAVING THE SAME

  • US 20090200567A1
  • Filed: 05/07/2007
  • Published: 08/13/2009
  • Est. Priority Date: 05/08/2006
  • Status: Active Grant
First Claim
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1. A chip-type light emitting diode (LED) package, comprising:

  • a thermally conductive substrate with lead electrodes formed thereon;

    an LED chip mounted on the thermally conductive substrate;

    a lower molding portion covering the LED chip; and

    an upper molding portion covering the lower molding portion, the upper molding portion having hardness higher than that of the lower molding portion and contains a phosphor uniformly dispersed therein.

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