INTEGRATED CIRCUIT PACKAGE AND A METHOD OF MAKING
First Claim
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1. An integrated circuit package comprising:
- a substrate,a first semiconductor chip, the first semiconductor chip being provided in a cavity on a first side of the substrate,a second semiconductor chip, the second semiconductor chip being provided on a second side of the substrate, andwherein the first semiconductor chip and the second semiconductor chip form a stack.
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Abstract
An integrated circuit package includes a substrate and a first semiconductor chip. The first semiconductor chip is provided in a cavity on a first side of the substrate. The package further includes a second semiconductor chip provided on a second side of the substrate. The first semiconductor chip and the second semiconductor chip form a stack.
45 Citations
25 Claims
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1. An integrated circuit package comprising:
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a substrate, a first semiconductor chip, the first semiconductor chip being provided in a cavity on a first side of the substrate, a second semiconductor chip, the second semiconductor chip being provided on a second side of the substrate, and wherein the first semiconductor chip and the second semiconductor chip form a stack. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An integrated circuit package comprising:
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a carrier element, a first semiconductor chip, the first semiconductor chip being provided in a cavity on a first side of the carrier element, a second semiconductor chip, the second semiconductor chip being provided on a second side of the carrier element, and wherein the first semiconductor chip and the second semiconductor chip form a stack. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A smart card comprising:
a chip package and a card carrier, the chip package being embedded in the card carrier, the chip package further comprising; a substrate, a first semiconductor chip, the first semiconductor chip being provided in a cavity on a first side of the substrate, a second semiconductor chip, the second semiconductor chip being provided on a second side of the substrate, and the first semiconductor chip and the second semiconductor chip form a stack. - View Dependent Claims (20, 21)
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22. A method of making an integrated circuit package, the method comprising:
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providing a substrate that includes a first side and a second side, providing a cavity on the first side of the substrate, mounting a first semiconductor chip in the cavity, mounting a second semiconductor chip to a second side of the substrate such that a portion of the substrate is located in an area between the first semiconductor chip and the second semiconductor chip. - View Dependent Claims (23, 24)
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25. A method of making an integrated circuit package, the method comprising:
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providing a carrier element that comprises a cavity on a first side of the carrier element, mounting a first semiconductor chip in the cavity, and mounting a second semiconductor chip to a second side of the carrier element such that a portion of the carrier element is located in an area between the first semiconductor chip and the second semiconductor chip.
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Specification