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INTEGRATED CIRCUIT PACKAGE AND A METHOD OF MAKING

  • US 20090200650A1
  • Filed: 02/08/2008
  • Published: 08/13/2009
  • Est. Priority Date: 02/08/2008
  • Status: Active Grant
First Claim
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1. An integrated circuit package comprising:

  • a substrate,a first semiconductor chip, the first semiconductor chip being provided in a cavity on a first side of the substrate,a second semiconductor chip, the second semiconductor chip being provided on a second side of the substrate, andwherein the first semiconductor chip and the second semiconductor chip form a stack.

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