CHIP ON BUS BAR

• US 20090200864A1
• Filed: 02/12/2008
• Published: 08/13/2009
• Est. Priority Date: 02/12/2008
• Status: Abandoned Application

• Current Assignee: Hamilton Sundstrand Corporation (Rtx Corporation)
• Original Assignee: Hamilton Sundstrand Corporation (Rtx Corporation)
• Inventors: Maier, Josef
• Application Number:
  US12/029,679
• Publication Number:
  US 20090200864A1
• Time in Patent Office: Days
• US Class Current: 307/9.100
• CPC Class Codes: B60R 16/0207 Wire harnesses
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Abstract

A bus bar assembly for a power distribution system is disclosed that includes first and second bus bars electrically isolated from one another. The bus bars are interconnected by a semiconductor switching element that is mounted on at least one of the first and second bus bars. In one example, the semiconductor switching element is a bare die that is secured directly to one of the first and second bus bars, for example, by a copper pad. A driver logic control device is in communication with the semiconductor switching element. The driver logic control device is configured to drive the semiconductor to electrically connect the first and second bus bars in response to a command to provide power to an aircraft component, such as a secondary power distribution box.

Claims

1. A bus bar assembly for a power distribution system comprising:

first and second bus bars electrically isolated from one another and interconnected by a semiconductor switching element that is supported by at least one of the first and second bus bars; and

a driver logic control device in communication with the semiconductor switching element, the driver logic control device configured to drive the semiconductor element to electrically connect the first and second bus bars in response to a command.

2. The assembly according to claim 1, wherein the bus bars are aluminum, and the one of the first and second bus bars includes a copper pad secured thereto, the bare semiconductor die secured to the copper pad.

3. The assembly according to claim 1, comprising wiring extending from the semiconductor switching element to the other of the first and second bus bars.

4. The assembly according to claim 3, comprising an isolator arranged between the first and second bus bars to electrically isolate the first and second bus bars from one another, the wiring extending over the isolator.

5. The assembly according to claim 3, comprising potting material arranged over the semiconductor switching element, wiring and the one of the first and second bus bars.

6. The assembly according to claim 1, comprising a housing surrounding the first and second bus bars, and wires extending from the first and second bus bars for communicating power between an aircraft component and the housing in response to the command.

7. The assembly according to claim 6, wherein the driver logic control device is arranged within the housing in a location remote from the semiconductor switching element.

8. The assembly according to claim 1, wherein the semiconductor switching element is at least one power MOSFET.

9. The assembly according to claim 1, wherein the semiconductor switching element includes at least one TRIAC, IGTB or SCR.

10. A power distribution system for an aircraft comprising:

a power distribution box including first and second bus bars electrically isolated from one another and interconnected by a semiconductor switching element that is mounted on at least one of the first and second bus bars;

an aircraft component interconnected to the first and second bus bars by wires; and

a driver logic control device in communication with the semiconductor switching element, the driver logic control device configured to drive the semiconductor to electrically connect the first and second bus bars in response to a command to provide power to the aircraft component.

11. The system according to claim 10, wherein the driver logic control device is arranged within the housing in a location remote from the semiconductor switching element.

12. The system according to claim 10, wherein the semiconductor switching element is a bare die that is secured to one of the first and second bus bars, and comprising wiring extending from the semiconductor switching element to the other of the first and second bus bars, an isolator arranged between the first and second bus bars to electrically isolate the first and second bus bars from one another, and potting material arranged over the semiconductor switching element, the wiring, and the one of the first and second bus bars.

13. The system according to claim 12, wherein the semiconductor switching element is at least one power MOSFET.

14. The system according to claim 12, wherein the semiconductor switching element includes at least one TRIAC, IGTB or SCR.