INTEGRATED INDUCTOR STRUCTURE AND METHOD OF FABRICATION

• US 20090201113A1
• Filed: 04/22/2009
• Published: 08/13/2009
• Est. Priority Date: 10/27/2004
• Status: Active Grant

• Current Assignee: Intel Corporation, Board of Trustees of the Leland Stanford Junior University (Stanford Management Co.)
• Original Assignee: Board of Trustees of the Leland Stanford Junior University (Stanford Management Co.)
• Inventors: Crawford, Ankur Mohan, Nair, Rajendran, Braunisch, Henning, Wang, Shan X., Vandentop, Gilroy
• Granted Patent: US 9,153,547 B2
• Time in Patent Office: Days
• US Class Current: 336/15
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01077 Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15312 being a pin array, e.g. PGA
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/09563 Metal filled via plated through-hole filled with insulating material H05K2201/0959
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602

Abstract

An inductor structure comprised of a magnetic section and a single turn solenoid. The single turn solenoid to contain within a portion of the magnetic section and circumscribed by the magnetic section.

Claims

1-25. -25. (canceled)

26. An inductor comprising:

a conductor layer;

a magnetic layer formed over said conductor layer;

a first conductive sidewall formed through said magnetic layer to adjoin with said conductor layer;

a second conductive sidewall formed through said magnetic layer to adjoin with said conductive layer, said first conductive sidewall and said second conductive sidewall having a portion of said magnetic layer there between;

a first conductive lip formed on said first conductive sidewall over said magnetic core; and

a second conductive lip formed on said second conductive sidewall over said magnetic core.

27. The inductor of claim 26 wherein said first conductive sidewall and second conductive sidewall are formed by vias.

28. The inductor of claim 27 wherein said conductive layer, said first conductive sidewall, said second conductive sidewall, said first conductive lip, and said second conductive lip are formed of copper.

29. The inductor of claim 28 wherein said magnetic layer is a soft magnetic material having a permeability of approximately 95-900.

30. The inductor of claim 26 wherein said magnetic layer is composed of a plurality of magnetic granules in a polymer host.

31. An inductor structure included in an inductor array comprising:

a magnetic material divided into a plurality of sections; and

a plurality of single turn solenoids each circumscribed by one of said plurality of sections with a portion of magnetic material contained within each of said single turn solenoids.

32. The inductor array of claim 31 wherein said plurality of sections are separated from each other by a dielectric material.

33. The inductor array of claim 31 formed in a build-up- packaging layer of an integrated circuit package.

34. The inductor array of claim 33 wherein one of said plurality of single turn solenoids is coupled to an integrated circuit device.

35. An inductor structure formed into an array comprising:

a plurality of conductive layers;

a plurality of magnetic layers formed over said conductive layers;

a plurality of conductive sidewall pairs formed through said plurality of magnetic layers to couple to said plurality of conductive layers and to define a magnetic core between each pair of said plurality of conductive sidewall pairs; and

a plurality of conductive lip pairs coupled to each of said plurality of conductive sidewall pairs to partially cover said magnetic core.

36. The inductor structure formed into art array of claim 35 further comprising dielectric material formed to isolate each of said plurality of magnetic layers

37. The inductor structure formed into an array of claim 36 wherein said dielectric material is selected from a group consisting of an Ajinomoto buildup film (ABP), a ceramic and a solder resist.

38. The inductor structure formed into an array of claim 35 formed within a build-up layer of an integrated circuit package substrate.

39. The inductor structure formed into an array of claim 36 coupled to power conversion circuitry.

40-72. -72. (canceled)