Display device having touch panel
First Claim
1. A display device having a touch panel comprising:
- a display panel; and
a touch panel which is arranged on the display panel in an overlapping manner in plane, whereinthe touch panel includes a first substrate and a second substrate which are arranged to face each other with spacers sandwiched therebetween, and a first semiconductor chip which is mounted on the first substrate,the first substrate includes, on a surface side thereof which faces the second substrate, a plurality of first lines which is arranged parallel to each other in the first direction, a first-chip mounting region on which the first semiconductor chip is mounted, and a plurality of first connection portions each of which is constituted of a portion of each line in the plurality of first lines,the first semiconductor chip includes a plurality of first bump electrodes which is arranged in one direction,the plurality of first connection portions are arranged in the arrangement direction of the plurality of first bump electrodes within the first-chip mounting region, andan arrangement pitch of the plurality of first bump electrodes is set larger than an arrangement pitch of the plurality of first connection portions.
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Accused Products
Abstract
The present invention realizes the reduction of cost of a display device having a touch panel. The display device having a touch panel includes a display panel, and a touch panel which is arranged on the display panel in an overlapping manner in plane. The touch panel includes a first substrate and a second substrate which are arranged to face each other with spacers sandwiched therebetween, and a first semiconductor chip which is mounted on the first substrate. The first substrate includes, on a surface side thereof which faces the second substrate, a plurality of first lines which is arranged parallel to each other in the first direction, a first chip mounting region on which the first semiconductor chip is mounted, and a plurality of first connection portions each of which is constituted of a portion of each line in the plurality of first lines, the first semiconductor chip includes a plurality of first bump electrodes which is arranged in one direction, the plurality of first connection portions are arranged in the arrangement direction of the plurality of first bump electrodes within the first-chip mounting region, and an arrangement pitch of the plurality of first bump electrodes is set larger than an arrangement pitch of the plurality of first connection portions.
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Citations
10 Claims
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1. A display device having a touch panel comprising:
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a display panel; and a touch panel which is arranged on the display panel in an overlapping manner in plane, wherein the touch panel includes a first substrate and a second substrate which are arranged to face each other with spacers sandwiched therebetween, and a first semiconductor chip which is mounted on the first substrate, the first substrate includes, on a surface side thereof which faces the second substrate, a plurality of first lines which is arranged parallel to each other in the first direction, a first-chip mounting region on which the first semiconductor chip is mounted, and a plurality of first connection portions each of which is constituted of a portion of each line in the plurality of first lines, the first semiconductor chip includes a plurality of first bump electrodes which is arranged in one direction, the plurality of first connection portions are arranged in the arrangement direction of the plurality of first bump electrodes within the first-chip mounting region, and an arrangement pitch of the plurality of first bump electrodes is set larger than an arrangement pitch of the plurality of first connection portions. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10)
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2. A display device having a touch panel comprising:
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a display panel; and a touch panel which is arranged on the display panel in an overlapping manner in plane, wherein the touch panel includes a first substrate and a second substrate which are arranged to face each other with spacers sandwiched therebetween, and a first semiconductor chip which is mounted on the first substrate, the first substrate includes, on a surface side thereof which faces the second substrate, a plurality of first lines which is arranged parallel to each other in the first direction, a first chip mounting region on which the first semiconductor chip is mounted, and a plurality of first connection portions each of which is constituted of a portion of each line in the plurality of first lines, the first semiconductor chip includes a plurality of first bump electrodes which is arranged in one direction, the plurality of first connection portions is arranged in the arrangement direction of the plurality of first bump electrodes within the first-chip mounting region, and the number of the plurality of first bump electrodes is set smaller than the number of the plurality of first connection portions.
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Specification