Fiber Optic Pressure Sensors and Catheters

• US 20090202195A1
• Filed: 01/21/2009
• Published: 08/13/2009
• Est. Priority Date: 02/11/2008
• Status: Active Grant

• Current Assignee: The Government Of The United States Of America, As Represented By The Secretary Of The Navy
• Original Assignee: The Government Of The United States Of America, As Represented By The Secretary Of The Navy
• Inventors: Lagakos, Nicholas, Bucaro, Joseph A
• Granted Patent: US 7,697,798 B2
• Time in Patent Office: Days
• US Class Current: 385/13
• CPC Class Codes: G01D 5/268 using optical fibres G01D5/28 - G01D5/38 take precedence
• CPC Class Codes: G01D 5/35312 using a Fabry Perot
• CPC Class Codes: G01L 9/0077 for measuring reflected light
• CPC Class Codes: G02B 6/262 Optical details of coupling light into, or out of, or between fibre ends, e.g. special fibre end shapes or associated optical elements

Abstract

A catheter with many fiber optic pressure sensors. The sensor diaphragm is formed from a wafer with a thin silicon layer and a silicon substrate layer separated by a silicon dioxide layer. A method includes masking and etching channels through the silicon substrate layer in a pattern of concentric circles to form a concentric circular etched channels and cylindrical unetched portions of the silicon substrate layer between the channels, exposing the silicon dioxide in the etched regions, and dissolving the exposed silicon dioxide to expose the crystalline silicon layer in the etched regions. The unetched cylindrical portion of the silicon substrate forms the diaphragm support element and the thin silicon layer forms the diaphragm. After applying a reflective coating to the exposed thin silicon layer, the support element face is adhered to the end face of a tubular housing, and a fiber optic probe is inserted in the tubular housing.

Claims

1. An intensity modulated fiber optic pressure sensor, comprising:

at least one multimode optical fiber with a core and cladding surrounding the core;

a diaphragm having a reflective surface and having an outer circumferential edge attached to a cylindrical support element; and

at least one cylindrical housing disposed circumferentially around the diaphragm and the optical fiber, an end face of the cylindrical housing being adhered to the cylindrical support element,

the diaphragm having an exterior face exposed to the exterior environment,

the diaphragm, the support element, and an end of the optical fiber forming a cavity.

2. The sensor according to claim 1, wherein the diaphragm is silicon.

3. The sensor according to claim 1, wherein the reflective surface comprises a metallic layer evaporated onto the diaphragm.

4. The sensor according to claim 1, wherein the diaphragm is diamond.

5. The sensor according to claim 2, wherein the support element is silicon.

6. The sensor according to claim 2, wherein the diaphragm and the cylindrical support element are formed by a process of masking and etching a portion of a first silicon layer of a silicon-on-insulator wafer, wherein the unetched portion forms the cylindrical support element, and a portion of a second thinner silicon layer of the silicon-on-insulator wafer that is exposed by the etching forms the diaphragm.

7. The sensor according to claim 2, wherein the diaphragm is formed by a process of:

providing a wafer with a thin silicon layer and a silicon substrate layer separated from the thin silicon layer by a silica layer;

masking and etching channels through the silicon substrate layer in a pattern of concentric circles to form a circular unetched portion of the silicon substrate layer between concentric circular etched channels,

said etching exposing the silica in the concentric circular etched channels;

removing a photoresist material;

and dissolving an exposed portion of the silica layer to expose the thin silicon layer in the concentric circular etched channels,

wherein the unetched circular portion of the silicon substrate layer forms the spacer and the thin silicon layer forms the diaphragm.

8. The sensor according to claim 1, wherein the at least one optical fiber includes only one optical fiber.

9. The sensor according to claim 1, wherein the at least one optical fiber includes two optical fibers.

10. The sensor according to claim 1, wherein the at least one optical fiber includes one optical fiber located along a central axis of the sensor and six optical fibers arranged around the one optical fiber.

11. The sensor according to claim 1, wherein in operation, light is transmitted from the end face of one of the at least one optical fibers, a pressure difference between the exterior and the cavity causes deflection of the diaphragm and causes a change in an amount of light reflected by the diaphragm into one of the at least one optical fibers.

12. The sensor according to claim 11, wherein the pressure difference is a static pressure difference.

13. The sensor according to claim 11, wherein the pressure difference is a dynamic pressure difference.

14. The sensor according to claim 1, wherein the housing includes at least one cylindrical tube.

15. The sensor according to claim 14, wherein the cylindrical tube is stainless steel.

16. The sensor according to claim 1, wherein the housing includes two concentric tubes, and an inner one of the two concentric tubes has an end face adhered to the cylindrical support element, and an outer one of the two concentric tubes has an end face that extends in a longitudinal direction at least as far as the exterior surface of the diaphragm.

17. The sensor according to claim 1, further comprising:

a second cylindrical support element disposed on an opposite face of the diaphragm, aligned with the cylindrical support element.

18. The sensor according to claim 1, further comprising:

a flexible polymer sheath enclosing the pressure sensor.

19. The sensor according to claim 1, wherein the diaphragm has a thickness of between about 1 and 2 microns.

20. A fiber optic pressure catheter system, comprising:

a plurality of fiber optic pressure sensors according to claim 1,

wherein said optical fibers of each of the plurality of fiber optic pressure sensors are bundled in a catheter sleeve with a diameter of less than 1 mm.

21. A method of forming an optical fiber sensor, comprising:

providing a wafer with a silicon substrate layer and a thin silicon layer having a thickness less than the thickness of the silicon substrate layer, and a silica layer positioned between the silicon substrate layer and the thin silicon layer;

masking and etching a pattern of concentric channels through the silicon substrate layer to form a continuous unetched portion of the silicon substrate layer between the concentric channels, said etching exposing the silica layer in the concentric etched channels;

exposing the thin silicon layer in the etched portion;

forming a reflective coating on the exposed portion of the thin silicon layer;

positioning a first hollow tube with an end face of the tube abutting the flat surface of the continuous unetched portion of the silicon substrate layer and affixing the end face of the first hollow tube to the unetched portion of the silica layer;

positioning an optical fiber probe having at least one optical fiber within the tube with an end face of the optical fiber spaced apart from the second silicon layer; and

affixing the optical fiber probe within the first hollow tube.

22. The method according to claim 21, wherein said positioning the optical fiber probe within the housing includes monitoring an amount of light reflected by the diaphragm and received by a photodetector while moving the optical fiber probe, and affixing the optical fiber probe within the tube at a distance at which the amount of light received by a photodetector is above a predetermined level.

23. The method according to claim 21, wherein the first hollow tube is cylindrical, wherein the concentric etched channels are circular, wherein the continuous unetched portion of the silicon substrate layer is circular, and the end face of the first hollow tube is adhered to the circular continuous unetched portion of the silicon substrate layer.

24. The method according to claim 23, wherein the housing further includes a second cylindrical tube surrounding the first cylindrical tube, the method further comprises:

breaking the wafer away from the first metal tube;

positioning the second cylindrical tube with an end extending beyond the diaphragm; and

adhering the second cylindrical tube to the first cylindrical tube.