Carrier for holding an object to be polished

• US 20090203300A1
• Filed: 04/14/2009
• Published: 08/13/2009
• Est. Priority Date: 03/09/2004
• Status: Abandoned Application

• Current Assignee: Speedfam Co., Ltd
• Original Assignee: Speedfam Co., Ltd
• Inventors: Yoshida, Akira, Shimizu, Toshikuni
• Application Number:
  US12/386,139
• Publication Number:
  US 20090203300A1
• Time in Patent Office: Days
• US Class Current: 451/398
• CPC Class Codes: B24B 41/067 radially supporting workpieces

Abstract

The present invention provides a diamond-like carbon coated carrier for holding an object to be polished used for double-sided polishing, and a manufacturing method therefor. The carrier for holding a workpiece according to the present invention has a substrate whose entire surface is coated with diamond-like carbon. The method of the present invention includes coating the entire carrier surface with diamond-like carbon using a surface coating apparatus using plasma CVD.

Claims

1. A carrier for holding an object to be polished, used for a double-sided polishing apparatus, comprising a substrate which has been subjected to lapping and/or polishing to provide the substrate with a uniform thickness and then coating the entire surface of the substrate with diamond-like carbon.

2. The carrier for holding an object to be polished used for a double-sided polishing apparatus of claim 1, wherein the relative standard deviation of the substrate thickness is no more than 0.4%.

3. The carrier for holding an object to be polished used for a double-sided polishing apparatus of claim 1, wherein the diamond-like carbon is formed into a film having a thickness of from 0.10 μ

m to 20 μ

m.

4. The carrier for holding an object to be polished used for a double-sided polishing apparatus of claim 1, wherein the substrate is made of a material selected from the group consisting of stainless steel, steel, aluminum, an aluminum alloy, a resin, a fiber-reinforced resin, and a composite thereof.

5. The carrier for holding an object to be polished used for a double-sided polishing apparatus of claim 1, wherein the carrier has a holding hole for holding the object and resinous portion surrounding the holding hole.