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TECHNIQUE FOR REDUCING WASTED MATERIAL ON A PRINTED CIRCUIT BOARD PANEL

  • US 20090205200A1
  • Filed: 04/04/2008
  • Published: 08/20/2009
  • Est. Priority Date: 02/20/2008
  • Status: Active Grant
First Claim
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1. A method for assembling a rigid-flex printed circuit board (PCB), comprising:

  • receiving at least two rigid-flex PCB that are to be coupled together, wherein a rigid-flex PCB includes at least one flexible PCB coupled to at least one rigid PCB;

    placing the at least two rigid-flex PCBs onto a carrier which is configured to;

    align the at least two rigid-flex PCBs so that bond regions located on the flexible PCBs overlap with bond regions located on corresponding flexible PCBs, andapply pressure to the overlapped bond regions;

    placing components at the specified locations on the at least two rigid-flex PCBs; and

    sending the carrier through a reflow oven which is configured to generate a temperature profile that reflows solder on the at least two rigid-flex PCBs so that the components become mechanically and electrically coupled to the at least two rigid-flex PCBs;

    wherein the temperature profile generated by the reflow oven and the pressure applied by the carrier cures and sets an anisotropic conductive film (ACF) located in the bond regions so that the overlapped flexible PCBs become mechanically and electrically coupled together.

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