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SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND WIRING BOARD

  • US 20090206470A1
  • Filed: 02/17/2009
  • Published: 08/20/2009
  • Est. Priority Date: 02/18/2008
  • Status: Active Grant
First Claim
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1. A semiconductor device manufacturing method comprising:

  • a semiconductor chip mounting step of mounting a semiconductor chip on a support board so as to expose a side of the semiconductor chip on which a plurality of terminal electrodes are provided;

    an insulating layer forming step of forming an insulating layer so as to cover the side of the semiconductor chip on which the terminal electrodes are provided;

    a through electrode forming step of forming through electrodes which connect to the terminal electrodes and pierce the insulating layer;

    a metal wiring forming step of forming metal wiring connecting to the through electrodes on the insulating layer; and

    an external terminal electrode forming step of forming external terminal electrodes for connecting the metal wiring to the outside on the metal wiring,wherein spacing between the adjacent external terminal electrodes is larger than spacing between the adjacent terminal electrodes.

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