ELECTRICAL DEVICE AND METHOD OF MANUFACTURING ELECTRICAL DEVICES USING FILM EMBOSSING TECHNIQUES TO EMBED INTEGRATED CIRCUITS INTO FILM
First Claim
1. A method of making an electrical device comprising:
- heating a chip;
embedding the chip in a substrate; and
coupling the chip to an electrical component.
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Abstract
An electrical device and method of making same is provided wherein a chip or other electrical component is embedded in a substrate. The substrate may be a thermoplastic material capable of deforming around the chip and at least partially encasing the chip when heat and/or pressure is applied to the substrate. Electromagnetic radiation such a near infrared radiation can be used to heat the substrate. The substrate may include a compressible layer that can be compressed and/or crushed to form a recess into which the chip can be inserted. Once embedded, the chip or electrical component is secured by the substrate and may be coupled to another electrical component. A method of making an RFID transponder is also provided wherein an RFID chip is embedded in a substrate using heat and/or pressure, an antenna structure is applied to the substrate, and the RFID chip and antenna structure are coupled together.
104 Citations
31 Claims
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1. A method of making an electrical device comprising:
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heating a chip; embedding the chip in a substrate; and coupling the chip to an electrical component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method of making an RFID transponder comprising:
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placing a chip having a bottom surface and a top surface on a thermoplastic substrate with the bottom surface of the chip contacting a top surface of the thermoplastic substrate; heating at least one of the thermoplastic substrate or chip with thermal radiation thereby elevating the temperature of the thermoplastic substrate and consequently softening the thermoplastic substrate; embedding the chip into the thermoplastic substrate by applying pressure to the chip while the substrate is heated to the elevated temperature; and coupling the chip to an antenna structure, wherein the coupling includes; depositing the antenna structure with conductive ink onto the thermoplastic substrate; and connecting the antenna structure to the interposer leads of the RFID interposer. - View Dependent Claims (20)
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21. A method of making an RFID transponder comprising:
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providing a web material, the web material including a continuous conductive element and a compressible substrate layer; forming a recess in the web material by compressing the compressible substrate layer, wherein forming the recess divides the conductive element thereby forming at least two antenna portions; placing a chip in the recess; and coupling the chip to the antenna portions, wherein the forming the recess includes pressing together of the chip and web material, and wherein the pressing effects the placing and the coupling. - View Dependent Claims (22, 23)
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24. A method of making an RFID transponder comprising:
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providing a web material, the web material including a compressible substrate layer and an antenna structure having a first antenna portion and a second antenna portion; forming a recess in the web material between the first and second antenna portions by compressing the compressible substrate layer; placing a chip in the recess; and coupling the chip antenna portions of the antenna structure; wherein the forming the recess includes pressing together of the chip and web material, and wherein the pressing effects the placing and the coupling. - View Dependent Claims (25, 26)
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27. An electrical device comprising;
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a chip; and a substrate; wherein the chip is embedded in the substrate; and wherein the chip is at least partially encased by the substrate. - View Dependent Claims (28, 29, 30, 31)
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Specification