ARTIFICIAL OPTIC NERVE NETWORK MODULE, ARTIFICIAL RETINA CHIP MODULE, AND METHOD FOR FABRICATING THE SAME

• US 20090210055A1
• Filed: 09/17/2008
• Published: 08/20/2009
• Est. Priority Date: 02/19/2008
• Status: Abandoned Application

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Lee, Min-Lin, Chang, Tao-Chih
• Application Number:
  US12/211,829
• Publication Number:
  US 20090210055A1
• Time in Patent Office: Days
• US Class Current: 623/6.630
• CPC Class Codes: A61F 2/141 Artificial eyes
• CPC Class Codes: A61F 9/08 Devices or methods enabling eye-patients to replace direct visual perception by another kind of perception
• CPC Class Codes: A61N 1/36046 of the eye

Abstract

An artificial retina chip module including a signal processing chip, a first polymer bump layer, and a photodiode array chip is provided. The signal processing chip includes a plurality of first pad disposed on a surface thereof. The first polymer bump layer includes a plurality of polymer bumps insulated from one another. Each of the first polymer bumps is composed of a polymer material and a conductive layer coated on the polymer material. Each first polymer bump is embedded into the corresponding first pad and the signal processing chip, wherein one end of the first polymer bump protrudes from the first pad and the other end thereof protrudes from a back surface of the signal processing chip. The photodiode array chip is disposed at one side of the signal processing chip and is electrically connected to the signal processing chip through the first polymer bumps.

Claims

1. An artificial optic nerve network module, comprising:

a plurality of chips, adapted for generating an artificial vision, and being stacked on one another; and

at least one polymer bump layer, embedded in one of the chips, so as to electrically connect the chip with another chip adjacent thereto, wherein the polymer bump layer comprises a plurality of polymer bumps insulated from one another, each of the polymer bumps is composed of a polymer material and a conductive layer coated on the polymer material, and the polymer bumps protrude from an upper surface and a lower surface of the chip.

2. The artificial optic nerve network module according to claim 1, wherein the chips at least comprises a photodiode array chip, a signal processing chip, a chip for replacing photoreceptor cells, a chip for replacing horizontal cells, a chip for replacing bipolar cells, and a chip for replacing ganglion cells.

3. The artificial optic nerve network module according to claim 1, wherein the conductive layer is made of a biocompatible conductive material or a non-metallic conductive material.

4. The artificial optic nerve network module according to claim 3, wherein the biocompatible conductive material is selected from the group consisting of titanium, gold, platinum, and their oxides.

5. The artificial optic nerve network module according to claim 3, wherein the non-metallic conductive material is selected from the group consisting of iridium oxide and graphite.

6. The artificial optic nerve network module according to claim 3, wherein a height of each of the polymer bumps varies according to a real curvature of the retina to be treated.

7. The artificial optic nerve network module according to claim 1, further comprising a biocompatible polymer layer disposed on the chip adjacent to the retina to be treated, wherein the biocompatible polymer layer exposes the polymer bumps which are connected to the retina.

8. The artificial optic nerve network module according to claim 1 further comprising a biocompatible polymer material covering the chips and the polymer bump layer, and exposing the polymer bumps which are connected to the retina to be treated.

9. An artificial retina chip module, comprising:

a signal processing chip, comprising a plurality of first pad disposed on a surface of the signal processing chip;

a first polymer bump layer, comprising a plurality of first polymer bumps insulated from one another, each of the first polymer bumps being composed of a polymer material and a conductive layer coated on the polymer material, wherein each of the first polymer bumps is embedded into the corresponding first pad and the signal processing chip, so that one end of the first polymer bump protrudes from the first pad, and the other end of the first polymer bump protrudes from a back surface of the signal processing chip; and

a photodiode array chip, disposed on one side of the signal processing chip and electrically connected to the signal processing chip through the first polymer bumps.

10. The artificial retina chip module according to claim 9, wherein the conductive layer is made of a biocompatible conductive material or a non-metallic conductive material.

11. The artificial retina chip module according to claim 10, wherein the biocompatible conductive material is selected from the group consisting of titanium, gold, platinum, and their oxides.

12. The artificial retina chip module according to claim 10, wherein the non-metallic conductive material is selected from the group consisting of iridium oxide and graphite.

13. The artificial retina chip module according to claim 9, wherein the signal processing chip further comprises a polymer material disposed among the first pads for insulating the first pads from one another.

14. The artificial retina chip module according to claim 9, wherein the first polymer bumps have different heights, and the heights of the first polymer bumps vary according to a real curvature of the retina to be treated.

15. The artificial retina chip module according to claim 9, further comprising a biocompatible polymer layer disposed at a back surface of the signal processing chip and exposing the first polymer bumps connected to the retina to be treated.

16. The artificial retina chip module according to claim 9, further comprising a biocompatible polymer material covering the signal processing chip, the first polymer bump layer, and the photodiode array chip, and exposing the first polymer bumps connected to the retina to be treated.

17. The artificial retina chip module according to claim 9, wherein the photodiode array chip comprises:

a plurality of second pads, disposed on a surface of the photodiode array chip; and

a second polymer bump layer, comprising a plurality of second polymer bumps which are insulated from one another, each of the second polymer bumps being composed of a polymer material and a conductive layer coated on the polymer material, wherein each of the second polymer bumps is embedded into the corresponding second pad and the photodiode array chip, so that one end of the second polymer bump protrudes from the second pad, and the other end of the second polymer bump protrudes from a back surface of the photodiode array chip, and each of the second polymer bumps is electrically connected to the corresponding first polymer bump.

18. The artificial retina chip module according to claim 17, wherein the conductive layer is made of a biocompatible conductive material or a non-metallic conductive material.

19. The artificial retina chip module according to claim 18, wherein the biocompatible conductive material is selected from the group consisting of titanium, gold, platinum, and their oxides.

20. The artificial retina chip module according to claim 18, wherein the non-metallic conductive material is selected from the group consisting of iridium oxide and graphite.

21. The artificial retina chip module according to claim 17, wherein the photodiode array chip further comprises a polymer material, disposed among the second pads for insulating the second pads from one another.

22. A method for fabricating a flexible electrode on a chip, comprising:

providing a chip having a plurality of pads disposed on a surface of the chip;

forming a photo resist layer on the surface of the chip for covering the pads;

forming a plurality of micro holes, wherein each of the micro holes passes through the photo resist layer and the pads, and extends inside the chip;

forming a first conductive layer on the photo resist layer and the micro holes;

removing the photo resist layer;

forming a photosensitive polymer layer on the surface of the chip, wherein the photosensitive polymer layer covers the pads and fills each of the micro holes;

patterning the photosensitive polymer layer to form a plurality of polymer bumps;

forming a second conductive layer on a surface of each of the polymer bumps, wherein the second conductive layer is electrically connected to the pad; and

thinning the chip, so that one end of each of the polymer bumps protrudes from the chip.

23. The method according to claim 22, wherein the micro holes are formed by a drilling process or a dry etching process.

24. The method according to claim 22, wherein the first conductive layer and the second conductive layer are made of a biocompatible conductive material or a non-metallic conductive material.

25. The method according to claim 24, wherein the biocompatible conductive material is selected from the group consisting of titanium, gold, platinum, and their oxides.

26. The method according to claim 24, wherein the non-metallic conductive material is selected from the group consisting of iridium oxide and graphite.

27. A method for fabricating an artificial retina chip module, comprising:

providing a signal processing chip having a plurality of pads disposed on a surface of the signal processing chip;

forming a photo resist layer on the surface of the signal processing chip for covering the pads;

forming a plurality of micro holes passing through the photo resist layer and the pads, and extending inside the signal processing chip;

forming a first conductive layer on the photo resist layer and the micro holes;

removing the photo resist layer;

forming a photosensitive polymer layer on the surface of the chip, wherein the photosensitive polymer layer covers the pads and fills each of the micro holes;

patterning the photosensitive polymer layer to form a plurality of polymer bumps;

forming a second conductive layer on a surface of each of the polymer bumps, the second conductive layer being electrically connected to the pad;

thinning the signal processing chip, so that one end of each of the polymer bumps protrudes from the chip; and

providing a photodiode array chip and electrically connecting the signal processing chip with the photodiode array chip through the polymer bumps.

28. The method according to claim 27, wherein the micro holes are formed by a drilling process or a dry etching process.

29. The method according to claim 27, wherein the first conductive layer and the second conductive layer are made of a biocompatible conductive material or a non-metallic conductive material.

30. The method according to claim 29, wherein the biocompatible conductive material is selected from the group consisting of titanium, gold, platinum, and their oxides.

31. The method according to claim 29, wherein the non-metallic conductive material is selected from the group consisting of iridium oxide and graphite.

32. The method according to claim 27, wherein the heights of the polymer bumps vary according to a real curvature of the retina to be treated.

33. The method according to claim 27, further comprising forming a biocompatible polymer layer at a back surface of the signal processing chip, wherein the biocompatible polymer layer exposes the polymer bumps connected to the retina to be treated.

34. The method according to claim 27, further comprising forming a biocompatible polymer material, wherein the biocompatible polymer material covers the signal processing chip, the polymer bumps, and the photodiode array chip, and exposes the polymer bumps connected to the retina to be treated.