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IC CHIP DESIGN MODELING USING PERIMETER DENSITY TO ELECTRICAL CHARACTERISTIC CORRELATION

  • US 20090210834A1
  • Filed: 02/15/2008
  • Published: 08/20/2009
  • Est. Priority Date: 02/15/2008
  • Status: Active Grant
First Claim
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1. A method comprising:

  • determining a perimeter density of conductive structure within each region of a plurality of regions of an integrated circuit (IC) chip design;

    correlating a measured electrical characteristic within a respective region of an IC chip that is based on the IC chip design to the perimeter density; and

    modeling the IC chip design based on the correlation.

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