CIRCUIT BOARD FOR DIRECT FLIP CHIP ATTACHMENT
First Claim
1. A packaging method comprising:
- forming a circuit board by forming a substantially continuous conductive layer on an insulating board and removing selected portions of the continuous conductive layer to define an electrically conductive trace;
laser cutting the electrically conductive trace to define sub-traces electrically isolated from each other by a laser-cut gap; and
bonding a light emitting diode (LED) chip to the circuit board across or adjacent to the laser-cut gap, the bonding including operatively electrically connecting an electrode of the LED chip to one of the sub-traces without using an interposed submount.
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Accused Products
Abstract
A packaging method comprises: forming a circuit board by forming a substantially continuous conductive layer on an insulating board and removing selected portions of the continuous conductive layer to define an electrically conductive trace; laser cutting the electrically conductive trace to define sub-traces electrically isolated from each other by a laser-cut gap formed by the laser cutting; and bonding a light emitting diode (LED) chip to the circuit board across or adjacent to the laser-cut gap, the bonding including operatively electrically connecting an electrode of the LED chip to one of the sub-traces without using an interposed submount. A semiconductor package comprises an LED chip flip-chip bonded to sub-traces of an electrically conductive trace of a circuit board, the sub-traces being electrically isolated from each other by a narrow gap of less than or about 100 microns.
225 Citations
24 Claims
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1. A packaging method comprising:
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forming a circuit board by forming a substantially continuous conductive layer on an insulating board and removing selected portions of the continuous conductive layer to define an electrically conductive trace; laser cutting the electrically conductive trace to define sub-traces electrically isolated from each other by a laser-cut gap; and bonding a light emitting diode (LED) chip to the circuit board across or adjacent to the laser-cut gap, the bonding including operatively electrically connecting an electrode of the LED chip to one of the sub-traces without using an interposed submount. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for bonding a semiconductor chip to a circuit board, the method comprising:
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laser cutting a conductive trace of the circuit board to define sub-traces electrically isolated from each other by a laser-cut gap formed by the laser cutting; and bonding the semiconductor chip to the circuit board across or adjacent to the laser-cut gap, the bonding including operatively electrically connecting the semiconductor chip with at least one of the sub-traces. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A semiconductor package comprising:
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a light emitting diode (LED) chip; and a circuit board on which the LED chip is attached by a flip-chip bond including operative electrical connections of n and p electrodes of the LED chip to respective sub-traces of an electrically conductive trace of the circuit board, the sub-traces being electrically isolated from each other by a narrow gap of less than or about 100 microns. - View Dependent Claims (22, 23, 24)
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Specification