SEMICONDUCTOR INPUT CONTROL DEVICE
First Claim
1. Semiconductor input control device for inputting mechanical signals into an electronic system comprising:
- a force sensor die formed within a semiconductor substrate, the force sensor die comprises side one and side two, electrical connection elements, force-application area and at least one force sensor providing electrical output signals in response to an external force applied to the force-application area;
a package enclosing at least part of the force sensor die; and
a force-transferring element cooperated with the force-application area, where the force transferring element transfers an external force to the force sensor die;
wherein the electrical connection elements and force-application area of the force-sensor die are located on the side one of the force sensor die and the force-transferring element is in contact with the force application area on the side one of the force sensor die when the external force is applied.
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Abstract
A force input control device suitable for high-volume applications such as cell phones, portable gaming devices and other handheld electronic devices along with other applications like medical equipment, robotics, security systems and wireless sensor networks is disclosed. The device can be one-axis or two-axis or three-axis sensitive broadening the range of applications. The device comprises a force sensor die formed within semiconductor substrate and containing a force sensor providing electrical output signal in response to applied external force, and electrical connection elements for mounting and/or wire bonding. Signal conditioning and processing integrated circuit can be integrated within some devices. A package enclosing at least a portion of the force sensor die and comprising a force-transferring element cooperated with the sensor die for transferring an external force to the force sensor die.
80 Citations
24 Claims
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1. Semiconductor input control device for inputting mechanical signals into an electronic system comprising:
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a force sensor die formed within a semiconductor substrate, the force sensor die comprises side one and side two, electrical connection elements, force-application area and at least one force sensor providing electrical output signals in response to an external force applied to the force-application area; a package enclosing at least part of the force sensor die; and a force-transferring element cooperated with the force-application area, where the force transferring element transfers an external force to the force sensor die; wherein the electrical connection elements and force-application area of the force-sensor die are located on the side one of the force sensor die and the force-transferring element is in contact with the force application area on the side one of the force sensor die when the external force is applied. - View Dependent Claims (2, 3, 4, 5, 6, 7, 9)
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8. Semiconductor input control device for inputting mechanical signals into an electronic system comprising:
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a force sensor die formed within a semiconductor substrate, the force sensor die comprising side one and side two, electrical connection elements, a force-application area, and at least one force sensor providing electrical output signals in response to an external force applied to the force-application area; and a package enclosing at least part of the force sensor die, the package comprising a force-transferring element that transfers an external force to the force sensor die; wherein the electrical connection elements are located on the side one of the force sensor die, the force-application area is located on the side two of the force sensor die and the force-transferring element is in contact with the force application area on the side two of the force sensor die when the external force is applied.
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10. Semiconductor input control device for inputting mechanical signals into an electronic system comprising:
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a force sensor die formed within a semiconductor substrate, the force sensor die comprising side one and side two, electrical connection elements, a force-application area and at least one force sensor providing electrical output signals in response to an external force applied to the force-application area; transistor integrated circuit formed within a semiconductor substrate, the transistor integrated circuit being electrically coupled with the at least one force sensors to receive the electrical signals; a package enclosing at least part of the force sensor die; and a force-transferring element that is cooperated with the force sensor die, where the force-transferring element transfers an external force to the force sensor die; wherein the transistor integrated circuit provides signal conditioning and signal processing of the electrical output signals from the at least one force sensor. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification