METHOD AND SYSTEM FOR A BALUN EMBEDDED IN AN INTEGRATED CIRCUIT PACKAGE

• US 20090212879A1
• Filed: 02/25/2008
• Published: 08/27/2009
• Est. Priority Date: 02/25/2008
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza
• Granted Patent: US 7,859,359 B2
• Time in Patent Office: Days
• US Class Current: 333/25
• CPC Class Codes: H01L 2223/6627 Waveguides, e.g. microstrip line, strip line, coplanar line
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15321 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19106 in a mirrored arrangement on two different side of a common die mounting substrate
• CPC Class Codes: H01P 5/10 for coupling balanced lines or devices with unbalanced lines or devices

Abstract

Methods and systems for a balun embedded in an integrated circuit package are disclosed and may include a multi-layer package bonded to an integrated circuit. The multi-layer package may include an integrated balun which may be enabled to process RF signals received from and/or communicated to an antenna. The integrated circuit may be flip-chip bonded to the multi-layer package. The balun may include ferromagnetic layers integrated in the multi-layer package, and may be bypassed via bypass switches integrated in the multi-layer package. The switches integrated in the multi-layer package may include MEMS switches. The balun may be bypassed via bypass switches in the integrated circuit. The switches in the integrated circuit may include CMOS switches. The balun may be impedance matched to the integrated circuit via surface mount devices, which may be coupled to the multi-layer package.

Claims

1. A method for wireless communication, the method comprising:

in an integrated circuit, processing received RF signals by a balun integrated in a multi-layer package, wherein said integrated circuit is bonded to said multi-layer package and said balun is enabled to process RF signals received from and/or communicated to an antenna.

2. The method according to claim 1, wherein said integrated circuit is flip-chip bonded to said multi-layer package.

3. The method according to claim 1, wherein said balun comprises ferromagnetic layers integrated in said multi-layer package.

4. The method according to claim 1, comprising bypassing said balun via bypass switches integrated in said multi-layer package.

5. The method according to claim 4, wherein said bypass switches integrated in said multi-layer package comprise MEMS switches.

6. The method according to claim 1, comprising bypassing said balun via bypass switches in said integrated circuit.

7. The method according to claim 6, wherein said switches in said integrated circuit comprise CMOS switches.

8. The method according to claim 1, comprising impedance matching said balun to said integrated circuit via surface mount devices.

9. The method according to claim 7, wherein said surface mount devices are coupled to said multi-layer package.

10. The method according to claim 1, wherein said balun is electrically coupled to said antenna.

11. A system for wireless communication, the system comprising:

a multi-layer package bonded to an integrated circuit, wherein said multi-layer package comprises an integrated balun and said balun is enabled to process RF signals received from and/or communicated to an antenna.

12. The system according to claim 11, wherein said integrated circuit is flip-chip bonded to said multi-layer package.

13. The system according to claim 11, wherein said balun comprises ferromagnetic layers integrated in said multi-layer package.

14. The system according to claim 11, wherein said integrated circuit bypasses said balun via bypass switches integrated in said multi-layer package.

15. The system according to claim 14, wherein said bypass switches integrated in said multi-layer package comprise MEMS switches.

16. The system according to claim 11, wherein said integrated circuit bypasses said balun via bypass switches in said integrated circuit.

17. The system according to claim 16, wherein said switches in said integrated circuit comprise CMOS switches.

18. The system according to claim 11, wherein said balun is impedance matched to said integrated circuit via surface mount devices.

19. The system according to claim 11, wherein said surface mount devices are coupled to said multi-layer package.

20. The system according to claim 11, wherein said balun is electrically coupled to said antenna.