METHOD AND SYSTEM FOR PROCESSING SIGNALS VIA DIRECTIONAL COUPLERS EMBEDDED IN AN INTEGRATED CIRCUIT PACKAGE

• US 20090212887A1
• Filed: 02/25/2008
• Published: 08/27/2009
• Est. Priority Date: 02/25/2008
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza
• Granted Patent: US 7,863,998 B2
• Time in Patent Office: Days
• US Class Current: 333/24.R
• CPC Class Codes: H01L 2223/6627 Waveguides, e.g. microstrip line, strip line, coplanar line
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15321 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01P 5/185 Edge coupled lines

Abstract

Methods and systems for processing signals via directional couplers embedded in an integrated circuit package are disclosed and may include generating via a directional coupler, one or more output RF signals that may be proportional to a received RF signal. The directional coupler may be integrated in a multi-layer package. The generated RF signal may be processed by an integrated circuit electrically coupled to the multi-layer package. The directional coupler may include quarter wavelength transmission lines, which may include microstrip or coplanar structures. The directional coupler may be electrically coupled to one or more variable capacitances in the integrated circuit. The variable capacitance may include CMOS devices in the integrated circuit. The directional coupler may include discrete devices, which may be surface mount devices coupled to the multi-layer package or may be devices integrated in the integrated circuit. The integrated circuit may be flip-chip bonded to the multi-layer package.

Claims

1. A method for wireless communication, the method comprising:

generating via a directional coupler, one or more output RF signals that are proportional to a received RF signal, wherein said directional coupler is integrated in a multi-layer package; and

processing said generated output RF signals via one or more circuits within an integrated circuit, wherein said integrated circuit is electrically coupled to said multi-layer package.

2. The method according to claim 1, wherein said directional coupler comprises quarter wavelength transmission lines or any integer multiple of quarter wavelength.

3. The method according to claim 2, wherein said transmission lines comprise a microstrip structure.

4. The method according to claim 2, wherein said transmission lines comprise a coplanar structure.

5. The method according to claim 1, comprising electrically coupling said directional coupler to one or more variable capacitances in said integrated circuit.

6. The method according to claim 5, wherein said one or more variable capacitances comprises CMOS devices in said integrated circuit.

7. The method according to claim 1, wherein said directional coupler comprises discrete devices.

8. The method according to claim 7, wherein said discrete devices comprise surface mount devices coupled to said multi-layer package.

9. The method according to claim 7, wherein said discrete devices comprise devices integrated within said integrated circuit.

10. The method according to claim 1, wherein said integrated circuit is flip-chip bonded to said multi-layer package.

11. A system for wireless communication, the system comprising:

a multilayer package bonded to an integrated circuit, wherein said multi-layer package comprises a directional coupler that generates one or more output RF signals that are proportional to a received RF signal; and

one or more circuits within said integrated circuit that processes said generated output RF signals.

12. The system according to claim 11, wherein said directional coupler comprises quarter wavelength transmission lines or any integer multiple of quarter wavelength.

13. The system according to claim 12, wherein said transmission lines comprise a microstrip structure.

14. The system according to claim 12, wherein said transmission lines comprise a coplanar structure.

15. The system according to claim 11, wherein said directional coupler is electrically coupled to one or more variable capacitances in said integrated circuit.

16. The system according to claim 15, wherein said one or more variable capacitances comprise CMOS devices in said integrated circuit.

17. The system according to claim 11, wherein said directional coupler comprises discrete devices.

18. The system according to claim 17, wherein said discrete devices comprise surface mount devices coupled to said multi-layer package.

19. The system according to claim 17, wherein said discrete devices comprise devices integrated within said integrated circuit.

20. The system according to claim 11, wherein said integrated circuit is flip-chip bonded to said multi-layer package.