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LOW THERMAL RESISTANCE POWER MODULE ASSEMBLY

  • US 20090213546A1
  • Filed: 10/18/2005
  • Published: 08/27/2009
  • Est. Priority Date: 01/11/2005
  • Status: Active Grant
First Claim
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1. A power module assembly with low thermal resistance, comprising:

  • a heat sink plate with a lower surface and an upper surface, the heat sink plate comprising a plurality of passageways for coolant extending from the lower surface to the upper surface;

    a circuit substrate positioned on the heat sink plate covering the coolant passageways, wherein the heat sink plate further comprises a recessed surface on the upper surface extending continuously about the periphery of one or more of the coolant passageways;

    a sealing member positioned in the recessed surface of the heat sink plate, the sealing member comprising a compressible material; and

    a set of power modules mounted on the circuit substrate opposite a bonding layer.

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