EMC SHIELDING FOR PRINTED CIRCUITS USING FLEXIBLE PRINTED CIRCUIT MATERIALS

• US 20090213565A1
• Filed: 02/27/2008
• Published: 08/27/2009
• Est. Priority Date: 02/27/2008
• Status: Abandoned Application

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Dangler, John M., Booth, Roger A. Jr., Doyle, Matthew S.
• Application Number:
  US12/038,356
• Publication Number:
  US 20090213565A1
• Time in Patent Office: Days
• US Class Current: 361/818
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2201/056 Folded around rigid support or component
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 3/403 Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof H05K3/4092 takes precedence
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

Exemplary embodiments of the present invention relate to a method for making multilayer flexible printed circuit carrier. The method comprises producing a first flexible conductor layer having a first width, producing a second flexible conductor layer having a second width larger than the first width, and separating a first side of the first flexible conductor and a first side of the second flexible conductors with a first insulator. The method also comprises placing a second insulator over at least a portion of a second surface of the first flexible conductor, and wrapping a portion of the second flexible conductor over the at least a portion of the second surface of the first flexible conductor.

Claims

1. A method for making multilayer flexible printed circuit carrier comprising:

producing a first flexible conductor layer having a first width;

producing a second flexible conductor layer having a second width larger than the first width;

separating a first side of the first flexible conductor and a first side of the second flexible conductors with a first insulator;

placing a second insulator over at least a portion of a second surface of the first flexible conductor; and

wrapping a portion of the second flexible conductor over at least a portion of the second surface of the first flexible conductor.

2. A multilayer flexible printed circuit carrier produced by:

producing a first flexible conductor layer having a first width;

producing a second flexible conductor layer having a second width larger than the first width;

separating a first side of the first flexible conductor and a first side of the second flexible conductors with a first insulator;

placing a second insulator over at least a portion of a second surface of the first flexible conductor; and

wrapping a portion of the second flexible conductor over at least a portion of the second surface of the first flexible conductor.