System and method for controlling a semiconductor manufacturing process

• US 20090215206A1
• Filed: 02/26/2008
• Published: 08/27/2009
• Est. Priority Date: 02/26/2008
• Status: Abandoned Application

• Current Assignee: Qimonda AG (Infineon Technologies AG)
• Original Assignee: Qimonda North America Corporation (Infineon Technologies AG)
• Inventors: Roberts, William, Singhal, Abeer, Gould, Christopher
• Application Number:
  US12/071,721
• Publication Number:
  US 20090215206A1
• Time in Patent Office: Days
• US Class Current: 438/17
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Abstract

A semiconductor manufacture and testing device is provided, comprising: a process device configured to perform a semiconductor processing operation on a semiconductor wafer; a testing device configured to perform a testing operation on the semiconductor wafer and generate real-time testing metrics relating to the testing operation; a data storage element configured to store the real-time testing metrics as stored testing metrics; a control and dispatch element configured to receive the stored testing metrics and generate dispatch control signals based on the stored testing metrics and a set of evaluation rules; and a test routing element located between the process element and the testing element, and configured to route the semiconductor wafer either from the process element to the testing element or from the process element around the testing element, based the dispatch control signals.

Claims

1. A semiconductor manufacture and testing device, comprising:

a process device configured to perform a semiconductor processing operation on a semiconductor wafer;

a testing device configured to perform a testing operation on the semiconductor wafer and generate real-time testing metrics relating to the testing operation;

a data storage element configured to store the real-time testing metrics as stored testing metrics;

a control and dispatch element configured to receive the stored testing metrics and generate dispatch control signals based on the stored testing metrics and a set of evaluation rules; and

a test routing element located between the process element and the testing element, and configured to route the semiconductor wafer either from the process element to the testing element or from the process element around the testing element, based the dispatch control signals.

2. The apparatus of claim 1, wherein the real-time testing metrics includes statistical process control (SPC) data with respect to the semiconductor wafer.

3. The apparatus of claim 2, wherein the SPC data includes wafer mechanical parameters of a wafer, wafer dimensional parameters, and wafer electrical properties.

4. The apparatus of claim 1,

wherein the process device is further configured to generate real-time process metrics relating to the processing operation,

wherein the data storage element is further configured to store the real-time process metrics as stored process metrics,

wherein the a control and dispatch element is further configured to receive the stored process metrics and generate the dispatch control signals based on the stored testing metrics, the stored process metrics, and the set of evaluation rules.

5. The apparatus of claim 1, wherein the real-time process metrics includes at least one of process history data for the semiconductor wafer, process history data for the process device, data relating to an operational status of the semiconductor manufacture and testing device.

6. A semiconductor manufacture and testing device, comprising:

a testing queue configured to receive and hold a semiconductor wafer in preparation for a testing operation;

a testing element configured to perform the testing operation on the semiconductor wafer and generate real-time testing metrics relating to the testing operation;

an internal routing element located between the testing queue and the testing element, and configured to route the semiconductor wafer either from the testing queue to the testing element or from the testing queue around the testing element, without performing the testing operation on the semiconductor wafer, based upon dispatch control signals;

a data storage element configured to store the real-time testing metrics as stored testing metrics;

a control and dispatch element configured to receive the stored testing metrics and generate the dispatch control signals based on the stored testing metrics and a set of evaluation rules; and

a test routing element located before the testing queue and configured to receive the semiconductor wafer and to route it either to the testing queue or around the testing queue and the testing element, without performing the testing operation on the semiconductor wafer, based on the dispatch control signals.

7. The apparatus of claim 6, wherein the real-time testing metrics includes statistical process control (SPC) data with respect to the semiconductor wafer.

8. The apparatus of claim 7, wherein the SPC data includes wafer mechanical parameters of a wafer, wafer dimensional parameters, and wafer electrical properties.

9. The apparatus of claim 6, further comprising:

a process device located before the test routing element and configured to perform a semiconductor processing operation on a semiconductor wafer,

wherein the process device is further configured to generate real-time process metrics relating to the processing operation,

wherein the data storage element is further configured to store the real-time process metrics as stored process metrics,

wherein the a control and dispatch element is further configured to receive the stored process metrics and generate the dispatch control signals based on the stored testing metrics, the stored process metrics, and the set of evaluation rules.

10. The apparatus of claim 9, wherein the real-time process metrics includes at least one of process history data for the semiconductor wafer, process history data for the process device, data relating to an operational status of the semiconductor manufacture and testing device.

11. A method of fabricating semiconductor devices, comprising:

performing a current semiconductor processing operation on a semiconductor wafer;

generating real-time process metrics relating to the current semiconductor processing operation;

storing the real-time process metrics in a set of stored evaluation metrics;

generating dispatch control signals based on the set of stored evaluation metrics and a set of evaluation rules; and

determining whether the semiconductor wafer needs to be tested based on the dispatch control signals.

12. The method of claim 11, further comprising:

performing a testing operation on the semiconductor wafer when the dispatch control signals indicates that testing should be performed;

generating real-time testing metrics relating to the testing operation; and

storing the real-time testing metrics in the evaluation metrics.

13. The method of claim 11, wherein the real-time testing metrics includes wafer mechanical parameters of a wafer, wafer dimensional parameters, and wafer electrical properties.

14. The method of claim 11, further comprising:

routing the semiconductor wafer to a next processing operation when the dispatch control signals indicates that testing should not be performed.

15. The method of claim 11, wherein the real-time process metrics includes at least one of process history data for the semiconductor wafer, process history data for the process device, data relating to an operational status of the semiconductor manufacture and testing device.

16. The method of claim 11, further comprising:

storing initial evaluation metrics prior to performing the semiconductor processing operation on the semiconductor wafer.

17. A method of fabricating semiconductor devices, comprising:

receiving a semiconductor wafer;

determining whether the semiconductor wafer needs to be tested based on dispatch control signals;

performing a testing operation on the semiconductor wafer;

storing the real-time testing metrics in a set of evaluation metrics; and

altering the dispatch control signals based on the set of evaluation testing metrics and a set of evaluation rules.

18. The method of claim 17, further comprising:

performing a current semiconductor processing operation on the semiconductor wafer prior to determining whether the semiconductor wafer needs to be tested;

generating real-time process metrics relating to the current semiconductor processing operation;

storing the real-time process metrics in the set of evaluation metrics; and

generating the dispatch control signals based on the stored evaluation metrics and the set of evaluation rules.

19. The method of claim 18, wherein the real-time process metrics includes at least one of process history data for the semiconductor wafer, process history data for the process device, data relating to an operational status of the semiconductor manufacture and testing device.

20. The method of claim 17, wherein the real-time testing metrics includes wafer mechanical parameters of a wafer, wafer dimensional parameters, and wafer electrical properties.

21. The method of claim 17, further comprising:

routing the semiconductor wafer to a next processing operation when the dispatch control signals indicates that testing should not be performed.

22. A semiconductor manufacture and testing device, comprising:

means for receiving a semiconductor wafer;

means for determining whether the semiconductor wafer needs to be tested based on dispatch control signals;

means for performing a testing operation on the semiconductor wafer;

means for storing the real-time testing metrics in a set of evaluation metrics; and

means for altering the dispatch control signals based on the set of evaluation testing metrics and a set of evaluation rules.

23. The method of claim 22, further comprising:

means for performing a current semiconductor processing operation on the semiconductor wafer prior to determining whether the semiconductor wafer needs to be tested;

means for generating real-time process metrics relating to the current semiconductor processing operation;

means for storing the real-time process metrics in the set of evaluation metrics; and

means for generating the dispatch control signals based on the stored evaluation metrics and the set of evaluation rules.

24. The method of claim 23, wherein the real-time process metrics includes at least one of process history data for the semiconductor wafer, process history data for the process device, data relating to an operational status of the semiconductor manufacture and testing device.

25. The method of claim 22, wherein the real-time testing metrics includes wafer mechanical parameters of a wafer, wafer dimensional parameters, and wafer electrical properties.

26. The method of claim 22, further comprising means for routing the semiconductor wafer to a next processing operation when the dispatch control signals indicates that testing should not be performed.