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Three dimensional structure memory

  • US 20090218700A1
  • Filed: 03/17/2009
  • Published: 09/03/2009
  • Est. Priority Date: 04/04/1997
  • Status: Active Grant
First Claim
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1. A stacked integrated circuit 1 comprising:

  • a plurality of thinned substantially flexible integrated circuits having topside and bottom-side surfaces, wherein each of said integrated circuits are stacked in relation to one another; and

    interconnections electrically connecting the plurality of thinned substantially flexible integrated circuits, wherein the interconnections are formed only on said surfaces.

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