INTEGRATED LED DRIVER FOR LED SOCKET

• US 20090218923A1
• Filed: 02/18/2009
• Published: 09/03/2009
• Est. Priority Date: 02/28/2008
• Status: Active Grant

• Current Assignee: TE Connectivity Solutions GmbH (TE Connectivity Ltd. (United Kingdom))
• Original Assignee: Tyco Electronics Corporation (TE Connectivity Ltd. (United Kingdom))
• Inventors: Daily, Christopher George, Gingrich, Charles Raymond III
• Granted Patent: US 8,018,136 B2
• Time in Patent Office: Days
• US Class Current: 313/1
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 23/006 the substrate being distinct from the light source holder
• CPC Class Codes: F21V 23/026 Fastening of transformers or ballasts
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

A mounting assembly for supporting an LED in a lighting fixture. A first substrate containing the LED has contact pads in electrical communication with the LED. A contact carrier has a plurality of contacts that correspond with the contact pads of the first substrate. A second substrate has electronic components to power the LED. A first contact arrangement on the second substrate engages the integral electrical contact portions of the contact carrier, and a second contact arrangement provides external connections to the electronic components. A heat sink portion is engaged in thermal contact with the contact carrier and the first substrate. The heat sink portion includes finned members for dissipation of heat generated by the LED disposed within the heat sink portion. A slot is provided in the heat sink projecting axially of the heat sink portion, for receiving and securing the second substrate.

Claims

1. An LED connector assembly for a lighting fixture comprising:

a first substrate comprising at least one LED mounted thereon, and a plurality of contact pads in electrical communication with the at least one LED;

a contact carrier comprising a plurality of integral electrical contact portions arranged about a perimeter of the contact carrier, the plurality of integral electrical contact portions corresponding to the plurality of electrical contact pads of the first substrate;

a second substrate comprising electronic components configured to power the at least one LED, a first contact arrangement configured to engage the integral electrical contact portions of the contact carrier, and a second contact arrangement for external connections to the electronic components; and

a heat sink portion retentively engageable in thermal communication with the carrier and the first substrate.

2. The assembly of claim 1, wherein the heat sink portion extends longitudinally from the contact carrier.

3. The assembly of claim 1, wherein the heat sink comprises a plurality of finned members for dissipation of heat generated by the first substrate.

4. The assembly of claim 1, further comprising at least one slot, the at least one slot projecting at least a portion of an axial length of the heat sink portion for integrally receiving the second substrate in electrical communication with the first substrate.

5. The assembly of claim 1, further comprising a cavity defined by a circumferential wall disposed at one end of the heat sink, the cavity configured to receive the first substrate.

6. The assembly of claim 1, wherein the plurality of integral electrical contact portions extend into a plurality of channels, the plurality of channels defined by fin portions configured to dissipate radiant heat.

7. The assembly of claim 1, wherein the at least one LED comprises three LEDs, each LED having an anode connected in common and an isolated cathode, the first substrate further comprising four contact pads for connecting each LED of the three LEDs to an external circuit.

8. The assembly of claim 5, wherein the contact carrier fits into the cavity in thermal contact against the first substrate to maintain the first substrate within cavity.

9. The assembly of claim 8, further comprising a locking ring defining an aperture, the locking ring attachable to the contact carrier.

10. The assembly of claim 9, wherein the first substrate urges the plurality of integral electrical contact portions into electrical contact with the contact pads, and into thermal communication with the heat sink.

11. The assembly of claim 1, wherein the second contact arrangement of the second substrate further comprises an external connector positioned adjacent a first edge of the second substrate, the external connector comprising wire leads connected to printed circuit pads, the external connector configured for interconnecting an external power source to at least one trace conductor etched in the second substrate.

12. The assembly of claim 11, wherein the second substrate further comprises at least one receptacle portion positioned adjacent a second edge of the second substrate.

13. The assembly of claim 11, the second substrate further comprising a plurality of surface mounted electronic components configured to power and control the at least one LED.

14. The assembly of claim 13, wherein the electronic components comprise at least one of a driver integrated circuit and a passive electronic component.

15. The assembly of claim 11, wherein the second substrate further comprises a plurality of receptacle portions, at least one receptacle portion including a pair of opposing spring arms disposed at a leading edge for receiving at least one of the integral electrical contact portions;

the spring arms comprising opposing leaf portions converging to a contact region, and diverging outwardly at a distal end to guide the integral electrical contact portion into the receptacle portion.

16. The assembly of claim 15, wherein at least one receptacle portion of the plurality of receptacle portions further comprises a frame portion surrounding at least a portion of at least one integral electrical contact portion, the frame portion configured to constrain movement of the integral electrical contact portion within the frame portion.

17. The assembly of claim 3, wherein the first substrate is an LED driver card, the LED driver card comprising at least one surface region free of printed circuit traces, the at least one surface region disposed adjacent an inner wall of at least one of the finned members, where the LED driver card and the inner wall are adjacent.

18. The assembly of claim 15, wherein the heat sink further comprises:

a first pair of channels in alignment with the integral contact portions to direct the second substrate into electrical communication with a first pair of contact portions of the plurality of integral electrical contact portions; and

a second pair of channels in alignment with a second pair of contact portions of the plurality of integral electrical contact portions.

19. The assembly of claim 18, wherein the first pair of channels is offset from the second pair of channels approximately 30°

axial rotation, and the second substrate is selectively insertable in either of the first pair of channels or the second pair of channels.

20. The assembly of claim 1, wherein the second substrate is connected with the contact carrier by an edge connector, the first contact arrangement comprising an upper contact pad and a lower contact pad disposed on opposite sides of the second substrate, the upper contact pad and a lower contact pad mateable with the plurality of integral electrical contact portions;

and the contact carrier further comprising a furcated contact arrangement configured to engage the contact pads of the first substrate.