Semiconductor integrated circuit device
First Claim
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1. A semiconductor integrated circuit device comprising:
- a semiconductor substrate;
circuit elements and wirings which are provided on one main surface of the semiconductor substrate and constitute a circuit;
first and second electrodes provided on the one main surface and electrically connected to the circuit;
an organic insulating film provided on the circuit except for openings on the surfaces of the first and second electrodes; and
a conductive layer placed on the organic insulating film which connects the first and second electrodes to each other.
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Abstract
Circuit elements and wirings constituting a circuit, and first electrodes electrically connected to such a circuit are provided on one main surface of a semiconductor substrate. An organic insulating film is formed on the circuit except for openings on the surfaces of the first electrodes. First and second external connecting electrodes are provided on the organic insulating film. At least one conductive layer for electrically connecting the first and second external connecting electrodes and the first electrodes is placed on the organic insulating film.
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Citations
21 Claims
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1. A semiconductor integrated circuit device comprising:
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a semiconductor substrate; circuit elements and wirings which are provided on one main surface of the semiconductor substrate and constitute a circuit; first and second electrodes provided on the one main surface and electrically connected to the circuit; an organic insulating film provided on the circuit except for openings on the surfaces of the first and second electrodes; and a conductive layer placed on the organic insulating film which connects the first and second electrodes to each other. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification