Solid-state imaging device, electronic camera

• US 20090219423A1
• Filed: 11/21/2008
• Published: 09/03/2009
• Est. Priority Date: 11/22/2007
• Status: Active Grant

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Suzuki, Satoshi
• Granted Patent: US 8,013,921 B2
• Time in Patent Office: Days
• US Class Current: 348/302
• CPC Class Codes: H04N 23/63 by using electronic viewfinders
• CPC Class Codes: H04N 23/672 based on the phase difference signals
• CPC Class Codes: H04N 25/134 based on three different wavelength filter elements
• CPC Class Codes: H04N 25/46 by combining or binning pixels
• CPC Class Codes: H04N 25/704 Pixels specially adapted for focusing, e.g. phase difference pixel sets
• CPC Class Codes: H04N 25/767 Horizontal readout lines, multiplexers or registers

Abstract

A solid-state imaging device includes a plurality of pixels disposed in a two-dimensional array that individually output analog pixel signals corresponding to amounts of light received thereat, a vertical scanning circuit that selects a pixel row, vertical signal lines each installed in correspondence to a pixel column, through which the pixel signals output from pixels belonging to the row selected by the vertical scanning circuit are transmitted, a horizontal scanning circuit that selects a plurality of pixel columns simultaneously, a composition circuit that combines pixel signals corresponding to the columns selected simultaneously by the horizontal scanning circuit, among the pixel signals output to the vertical signal lines, a first conversion circuit that converts the analog composite pixel signal generated at the composition circuit to a digital signal and a horizontal signal line through which the pixel signal digitized at the first conversion circuit is transmitted.

Claims

1. A solid-state imaging device, comprising:

a plurality of pixels that are disposed in a two-dimensional array and individually output analog pixel signals corresponding to amounts of light received thereat;

a vertical scanning circuit that selects a row of the pixels;

vertical signal lines each installed in correspondence to a column of the pixels, through which the pixel signals output from pixels belonging to the row selected by the vertical scanning circuit are transmitted;

a horizontal scanning circuit that selects a plurality of columns of the pixels simultaneously;

a composition circuit that generates a composite signal by combining pixel signals corresponding to a plurality of columns selected simultaneously by the horizontal scanning circuit, among the pixel signals output to the vertical signal lines;

a first conversion circuit that converts the analog composite pixel signal generated at the composition circuit to a digital signal; and

a horizontal signal line through which the pixel signal having been digitized at the first conversion circuit is transmitted.

2. A solid-state imaging device according to claim 1, further comprising:

a direct signal line through which the composite pixel signal generated at the composition circuit is transmitted to the horizontal signal line by bypassing the first conversion circuit; and

a selector circuit that selects either the first conversion circuit or the direct signal line to connect with the composition circuit.

3. A solid-state imaging device according to claim 2, further comprising:

a second conversion circuit that converts the analog composite pixel signal having been generated at the composition circuit and transmitted to the horizontal signal line through the direct signal line by bypassing the first conversion circuit, to a digital signal.

4. A solid-state imaging device according to claim 2, wherein:

the direct signal line is installed in correspondence to each group made up with a predetermined number of pixel columns; and

composite pixel signals originating from a plurality of groups, each having been generated at the composition circuit and transmitted to the horizontal signal line through the direct signal line by bypassing the first conversion circuit, are further combined.

5. A solid-state imaging device according to claim 1, wherein:

the composition circuit is installed in correspondence to each group made up with a predetermined number of pixel columns; and

the horizontal scanning circuit simultaneously selects a plurality of pixel columns within the group.

6. A solid-state imaging device according to claim 1, wherein:

the plurality of pixels include focus detection pixels that output pixel signals used in focus detection executed for an imaging optical system and imaging pixels that output pixel signals used to capture an image formed through the imaging optical system.

7. A solid-state imaging device according to claim 6, wherein:

the focus detection pixels include a first focus detection pixel that receives a light flux having passed through a first area of an exit pupil of the imaging optical system and a second focus detection pixel that receives a light flux having passed through a second area, different from the first area, of the exit pupil of the imaging optical system;

the first focus detection pixel and the second focus detection pixel are disposed within a single row; and

when the row having disposed therein the first focus detection pixel and the second focus detection pixel is selected by the vertical scanning circuit, the horizontal scanning circuit simultaneously selects a column in which the first focus detection pixel is disposed and a column in which the second focus detection pixel is disposed.

8. A solid-state imaging device according to claim 2, wherein:

the plurality of pixels include focus detection pixels that output pixel signals used in focus detection executed for an imaging optical system and imaging pixels that output pixel signals used to capture an image formed through the imaging optical system; and

when a row having disposed therein the focus detection pixel is selected by the vertical scanning circuit, the selector circuit selects the direct signal line to connect with the composition circuit, whereas when a row with no focus detection pixel disposed therein is selected by the vertical scanning circuit, the selector circuit selects the first conversion circuit to connect with the composition circuit.

9. An electronic camera comprising a solid-state imaging device according to claim 1.

10. An electronic camera according to claim 9, further comprising:

a display means for bringing up a live view display of an image formed through the imaging optical system based upon output signals provided from the solid-state imaging device.